
Intel Corporation
10AX115N2F40E2LG
10AX115N2F40E2LG ECAD Model
10AX115N2F40E2LG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 600 | |
Number of Outputs | 600 | |
Number of Logic Cells | 1150000 | |
Number of CLBs | 42720 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 42720 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1517 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1517,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1517,39X39,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX115N2F40E2LG Datasheet Download
10AX115N2F40E2LG Overview
The chip model 10AX115N2F40E2LG is a powerful and advanced integrated circuit that provides a wide range of features and benefits for a variety of applications. It is designed to be a low-power, high-performance solution for a variety of applications in networks, intelligent systems, and other areas.
The 10AX115N2F40E2LG chip model offers several advantages that make it an attractive choice for many applications. It is designed for high-speed operation and provides a wide operating temperature range, making it suitable for a variety of environments. The chip also features a low-power consumption and high-efficiency design, making it ideal for applications that require a low-power solution. Additionally, the 10AX115N2F40E2LG chip model is designed to be able to run multiple programs in parallel, making it a great choice for applications that require multitasking capabilities.
The 10AX115N2F40E2LG chip model is expected to be in high demand in the future, especially in the areas of networks and intelligent systems. As the world moves towards a more interconnected and intelligent future, the 10AX115N2F40E2LG chip model will be an important component in the development of these systems. It is expected to be used in a variety of applications, including intelligent networks, autonomous systems, and other applications.
The 10AX115N2F40E2LG chip model has specific design requirements that must be met in order for it to be used in a particular application. For example, the chip must be able to operate at a certain temperature, voltage, and frequency range. Additionally, the chip must be able to handle certain amounts of data and be able to process it in a certain amount of time.
In order to ensure that the 10AX115N2F40E2LG chip model is used correctly, it is important to understand the specific design requirements and to follow the manufacturer's instructions. Additionally, it is important to understand the chip's limitations and to be aware of any potential issues that may arise. There are also a number of case studies available that provide insight into how the 10AX115N2F40E2LG chip model has been used in various applications.
The 10AX115N2F40E2LG chip model is a powerful and advanced integrated circuit that provides a wide range of features and benefits for a variety of applications. With its low-power, high-performance design and wide operating temperature range, it is an ideal choice for applications that require a low-power solution. Additionally, its ability to run multiple programs in parallel makes it a great choice for applications that require multitasking capabilities. As the world moves towards a more interconnected and intelligent future, the 10AX115N2F40E2LG chip model is expected to be in high demand, and it will be an important component in the development of intelligent networks and autonomous systems. It is important to understand the specific design requirements of the chip model and to follow the manufacturer's instructions in order to ensure that it is used correctly. Additionally, there are a number of case studies available that provide insight into how the 10AX115N2F40E2LG chip model has been used in various applications.
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1,528 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $6,257.8138 | $6,257.8138 |
10+ | $6,190.5254 | $61,905.2544 |
100+ | $5,854.0838 | $585,408.3840 |
1000+ | $5,517.6422 | $2,758,821.1200 |
10000+ | $5,046.6240 | $5,046,624.0000 |
The price is for reference only, please refer to the actual quotation! |