Intel Corporation
10AX115N1F45E1SG
10AX115N1F45E1SG ECAD Model
10AX115N1F45E1SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 768 | |
| Number of Outputs | 768 | |
| Number of Logic Cells | 1150000 | |
| Number of CLBs | 42720 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 42720 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1932 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1932 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1932,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1932,44X44,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX115N1F45E1SG Datasheet Download
10AX115N1F45E1SG Overview
The chip model 10AX115N1F45E1SG is an advanced integrated circuit developed by a leading semiconductor company. It was designed to provide a reliable, secure and cost-effective solution for a variety of communication systems. The model is based on a state-of-the-art technology and is capable of providing high-speed, low-power data transmission.
The original design intention of the chip model 10AX115N1F45E1SG was to provide a reliable and cost-effective solution for communication systems. It is capable of providing high-speed and low-power data transmission, making it suitable for a wide range of applications. The chip model also has the potential to be upgraded in the future to meet the demands of the ever-evolving communication technology.
The chip model 10AX115N1F45E1SG can be applied to advanced communication systems. It is capable of providing high-speed data transmission, making it suitable for the development of networks and intelligent systems. With its low-power consumption and high-speed capabilities, the model is also capable of being used in the era of fully intelligent systems.
The chip model 10AX115N1F45E1SG can also be applied to the development and popularization of future intelligent robots. The model is capable of providing the necessary data transmission capabilities for robots to be able to communicate with each other and interact with their environment. To use the model effectively, technical talents such as software engineers, computer scientists, and robotics experts are needed.
In conclusion, the chip model 10AX115N1F45E1SG is an advanced integrated circuit designed to provide a reliable and cost-effective solution for a variety of communication systems. It has the potential to be upgraded in the future and can be applied to advanced communication systems, networks, and intelligent systems. The model can also be used in the development and popularization of future intelligent robots and requires technical talents to use it effectively.
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2,621 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $6,986.1950 | $6,986.1950 |
| 10+ | $6,911.0746 | $69,110.7459 |
| 100+ | $6,535.4727 | $653,547.2712 |
| 1000+ | $6,159.8708 | $3,079,935.4160 |
| 10000+ | $5,634.0282 | $5,634,028.2000 |
| The price is for reference only, please refer to the actual quotation! | ||