Intel Corporation
10AX115H4F34I3SG
10AX115H4F34I3SG ECAD Model
10AX115H4F34I3SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 504 | |
| Number of Outputs | 504 | |
| Number of Logic Cells | 1150000 | |
| Number of CLBs | 42720 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 42720 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX115H4F34I3SG Datasheet Download
10AX115H4F34I3SG Overview
The chip model 10AX115H4F34I3SG is a powerful semiconductor device that has become increasingly popular in the industry due to its impressive performance and features. It is a high-performance and cost-effective solution for a wide range of applications, including communication systems, intelligent robots, and more.
In terms of industry trends, the chip model 10AX115H4F34I3SG is becoming increasingly popular due to its ability to provide high-performance solutions at a lower cost. This is due to its advanced features, such as its high-speed operation, low power consumption, and high integration. This makes it an ideal choice for a variety of applications, from communication systems to intelligent robots.
In terms of future development, the chip model 10AX115H4F34I3SG is expected to be upgraded to provide even better performance and features. This could include the addition of new technologies, such as improved signal processing capabilities, higher data rates, and better power management. This could also include the development of new applications, such as intelligent robots and other advanced communication systems.
In terms of application environment, the chip model 10AX115H4F34I3SG can be used effectively by technical professionals who are familiar with the technology. This includes engineers, software developers, and other professionals who are knowledgeable in the design and implementation of the chip. It is important to note that the chip model 10AX115H4F34I3SG is not a plug-and-play solution and requires an understanding of the underlying technology in order to be used effectively.
Overall, the chip model 10AX115H4F34I3SG is an impressive semiconductor device that has become increasingly popular due to its impressive performance and features. It is expected to be upgraded in the future to provide even better performance and features. In order to use the chip effectively, technical professionals who are familiar with the technology must be employed. This chip model is expected to be the key to the development and popularization of future intelligent robots and other advanced communication systems.
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4,297 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $15,600.4478 | $15,600.4478 |
| 10+ | $15,432.7010 | $154,327.0100 |
| 100+ | $14,593.9673 | $1,459,396.7250 |
| 1000+ | $13,755.2335 | $6,877,616.7500 |
| 10000+ | $12,581.0063 | $12,581,006.2500 |
| The price is for reference only, please refer to the actual quotation! | ||