Intel Corporation
10AX115H3F34I2SG
10AX115H3F34I2SG ECAD Model
10AX115H3F34I2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 504 | |
| Number of Outputs | 504 | |
| Number of Logic Cells | 1150000 | |
| Number of CLBs | 42720 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 42720 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX115H3F34I2SG Datasheet Download
10AX115H3F34I2SG Overview
The chip model 10AX115H3F34I2SG is a powerful and versatile processor designed for high-performance digital signal processing, embedded processing, and image processing applications. It is capable of high-speed data processing and is able to handle large amounts of data quickly and efficiently. As such, it is an ideal choice for applications that require the use of HDL (Hardware Description Language) language.
The industry trends of the chip model 10AX115H3F34I2SG are constantly evolving and adapting to the changing needs of the market. As technology advances, new technologies are needed to support the application environment. This includes the need for faster data processing speeds, improved power efficiency, and enhanced security capabilities. In addition, the chip model 10AX115H3F34I2SG can also be used in networks and in intelligent scenarios, such as autonomous driving and artificial intelligence.
The chip model 10AX115H3F34I2SG is a versatile processor that can be used in a variety of applications. It is capable of high-speed data processing, making it ideal for applications that require the use of HDL language. As technology advances, new technologies are needed to support the application environment, and the chip model 10AX115H3F34I2SG can be used in networks and intelligent scenarios. In the future, it is likely that the chip model 10AX115H3F34I2SG will be used in the era of fully intelligent systems, as it is capable of providing the necessary data processing speeds, power efficiency, and security capabilities. The chip model 10AX115H3F34I2SG is an ideal choice for those who need a powerful and versatile processor for their applications.
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2,468 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $20,022.9047 | $20,022.9047 |
| 10+ | $19,807.6047 | $198,076.0469 |
| 100+ | $18,731.1044 | $1,873,110.4437 |
| 1000+ | $17,654.6042 | $8,827,302.0910 |
| 10000+ | $16,147.5038 | $16,147,503.8250 |
| The price is for reference only, please refer to the actual quotation! | ||