10AX115H3F34E2LG
10AX115H3F34E2LG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AX115H3F34E2LG


10AX115H3F34E2LG
F18-10AX115H3F34E2LG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1152,34X34,40
BGA, BGA1152,34X34,40

10AX115H3F34E2LG ECAD Model


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10AX115H3F34E2LG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 504
Number of Outputs 504
Number of Logic Cells 1150000
Number of CLBs 42720
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology TSMC
Organization 42720 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1152,34X34,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AX115H3F34E2LG Datasheet Download


10AX115H3F34E2LG Overview



The chip model 10AX115H3F34E2LG is a high-performance chip developed by a leading semiconductor manufacturer. It is designed to meet the needs of the most demanding applications and provides superior performance in terms of speed, power, and reliability. This chip model has been widely adopted in many industries, such as automotive, consumer electronics, industrial, and medical.


The 10AX115H3F34E2LG has a number of features that make it a great choice for many applications. It is designed to be highly efficient, allowing it to run at lower voltage levels while still delivering the same level of performance. It also has a low power consumption, which means that it can be used in a variety of applications without consuming too much energy. Additionally, the chip has a high level of integration, which allows for a smaller form factor and easier integration into existing systems.


The 10AX115H3F34E2LG is also designed to be reliable and robust. It has a built-in error correction and safety features, along with a wide operating temperature range. This makes it suitable for a variety of applications, from automotive to medical. Additionally, the chip has a high level of integration, which allows for a smaller form factor and easier integration into existing systems.


The 10AX115H3F34E2LG is expected to be in high demand in the future. This is due to its superior performance, low power consumption, and high level of integration. Additionally, the chip is designed to be reliable and robust, making it suitable for a variety of applications. This chip model is also expected to be in high demand in the automotive, consumer electronics, industrial, and medical markets, as it is designed to meet the needs of these industries.


In order to determine whether the application environment requires the support of new technologies, the specific design requirements of the chip model 10AX115H3F34E2LG need to be considered. This includes the power and voltage requirements, the operating temperature range, the error correction and safety features, and the level of integration. Additionally, actual case studies and precautions should be taken into consideration when using the chip model 10AX115H3F34E2LG.


Overall, the chip model 10AX115H3F34E2LG is a high-performance chip designed to meet the needs of the most demanding applications. It has a number of features that make it a great choice for many industries, such as automotive, consumer electronics, industrial, and medical. Additionally, the chip is expected to be in high demand in the future due to its superior performance, low power consumption, and high level of integration. In order to determine whether the application environment requires the support of new technologies, the specific design requirements of the chip model 10AX115H3F34E2LG need to be considered, along with actual case studies and precautions.



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Unit Price: $23,060.6311
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $21,446.3869 $21,446.3869
10+ $21,215.7806 $212,157.8061
100+ $20,062.7491 $2,006,274.9057
1000+ $18,909.7175 $9,454,858.7510
10000+ $17,295.4733 $17,295,473.3250
The price is for reference only, please refer to the actual quotation!

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