
Intel Corporation
10AX115H3F34E2LG
10AX115H3F34E2LG ECAD Model
10AX115H3F34E2LG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 504 | |
Number of Outputs | 504 | |
Number of Logic Cells | 1150000 | |
Number of CLBs | 42720 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 42720 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1152,34X34,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX115H3F34E2LG Datasheet Download
10AX115H3F34E2LG Overview
The chip model 10AX115H3F34E2LG is a high-performance chip developed by a leading semiconductor manufacturer. It is designed to meet the needs of the most demanding applications and provides superior performance in terms of speed, power, and reliability. This chip model has been widely adopted in many industries, such as automotive, consumer electronics, industrial, and medical.
The 10AX115H3F34E2LG has a number of features that make it a great choice for many applications. It is designed to be highly efficient, allowing it to run at lower voltage levels while still delivering the same level of performance. It also has a low power consumption, which means that it can be used in a variety of applications without consuming too much energy. Additionally, the chip has a high level of integration, which allows for a smaller form factor and easier integration into existing systems.
The 10AX115H3F34E2LG is also designed to be reliable and robust. It has a built-in error correction and safety features, along with a wide operating temperature range. This makes it suitable for a variety of applications, from automotive to medical. Additionally, the chip has a high level of integration, which allows for a smaller form factor and easier integration into existing systems.
The 10AX115H3F34E2LG is expected to be in high demand in the future. This is due to its superior performance, low power consumption, and high level of integration. Additionally, the chip is designed to be reliable and robust, making it suitable for a variety of applications. This chip model is also expected to be in high demand in the automotive, consumer electronics, industrial, and medical markets, as it is designed to meet the needs of these industries.
In order to determine whether the application environment requires the support of new technologies, the specific design requirements of the chip model 10AX115H3F34E2LG need to be considered. This includes the power and voltage requirements, the operating temperature range, the error correction and safety features, and the level of integration. Additionally, actual case studies and precautions should be taken into consideration when using the chip model 10AX115H3F34E2LG.
Overall, the chip model 10AX115H3F34E2LG is a high-performance chip designed to meet the needs of the most demanding applications. It has a number of features that make it a great choice for many industries, such as automotive, consumer electronics, industrial, and medical. Additionally, the chip is expected to be in high demand in the future due to its superior performance, low power consumption, and high level of integration. In order to determine whether the application environment requires the support of new technologies, the specific design requirements of the chip model 10AX115H3F34E2LG need to be considered, along with actual case studies and precautions.
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1,416 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $21,446.3869 | $21,446.3869 |
10+ | $21,215.7806 | $212,157.8061 |
100+ | $20,062.7491 | $2,006,274.9057 |
1000+ | $18,909.7175 | $9,454,858.7510 |
10000+ | $17,295.4733 | $17,295,473.3250 |
The price is for reference only, please refer to the actual quotation! |