Intel Corporation
10AX115H2F34I2LG
10AX115H2F34I2LG ECAD Model
10AX115H2F34I2LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 504 | |
| Number of Outputs | 504 | |
| Number of Logic Cells | 1150000 | |
| Number of CLBs | 42720 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 42720 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX115H2F34I2LG Datasheet Download
10AX115H2F34I2LG Overview
The chip model 10AX115H2F34I2LG is a powerful and versatile chip model that has been developed by leading chip manufacturer XYZ. It is designed to meet the needs of a wide range of industries, from consumer electronics to industrial automation. This chip model offers a range of advantages, such as improved performance, greater reliability, and enhanced energy efficiency.
The chip model 10AX115H2F34I2LG has been designed to meet the demands of the current market, with the intention of providing a reliable and cost-effective solution for a range of applications. The model has been designed to be compatible with a range of communication systems, including wired, wireless, and optical systems. This makes it suitable for a variety of industrial applications, such as automation and control systems, as well as consumer electronics.
The chip model 10AX115H2F34I2LG is expected to experience an increasing demand in the coming years, as more industries begin to adopt the technology. As the chip model is designed to be compatible with a range of communication systems, it is likely to be used in various industrial applications, such as industrial automation, consumer electronics, and automotive systems.
The chip model 10AX115H2F34I2LG is also designed with the potential for future upgrades, allowing it to be used in more advanced communication systems. This means that the chip model can be used in the latest 5G networks, as well as in more advanced intelligent systems. As the chip model is designed to be compatible with a range of communication systems, it is possible to use it in the era of fully intelligent systems.
The chip model 10AX115H2F34I2LG is also likely to be used in a range of intelligent scenarios, such as smart homes, smart cities, and autonomous vehicles. The chip model is designed to be compatible with a range of communication systems, making it suitable for a variety of intelligent applications. As the chip model is designed to be compatible with a range of communication systems, it is also possible to use it in the era of fully intelligent systems.
In conclusion, the chip model 10AX115H2F34I2LG is a powerful and versatile chip model that has been designed to meet the demands of the current market. It offers a range of advantages, such as improved performance, greater reliability, and enhanced energy efficiency. The chip model is expected to experience an increasing demand in the coming years, as more industries begin to adopt the technology. Furthermore, the chip model is designed with the potential for future upgrades, allowing it to be used in more advanced communication systems. Finally, the chip model is likely to be used in a range of intelligent scenarios, such as smart homes, smart cities, and autonomous vehicles.
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5,503 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $27,300.9984 | $27,300.9984 |
| 10+ | $27,007.4393 | $270,074.3932 |
| 100+ | $25,539.6437 | $2,553,964.3701 |
| 1000+ | $24,071.8481 | $12,035,924.0430 |
| 10000+ | $22,016.9342 | $22,016,934.2250 |
| The price is for reference only, please refer to the actual quotation! | ||