10AX115H2F34E2LG
10AX115H2F34E2LG
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rohs

Intel Corporation

10AX115H2F34E2LG


10AX115H2F34E2LG
F18-10AX115H2F34E2LG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1152,34X34,40
BGA, BGA1152,34X34,40

10AX115H2F34E2LG ECAD Model


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10AX115H2F34E2LG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 504
Number of Outputs 504
Number of Logic Cells 1150000
Number of CLBs 42720
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology TSMC
Organization 42720 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1152,34X34,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AX115H2F34E2LG Datasheet Download


10AX115H2F34E2LG Overview



Chip model 10AX115H2F34E2LG is a high-performance, low-power device that is well-suited to a variety of digital signal processing, embedded processing, and image processing applications. It is designed to be programmed with an HDL language, allowing for more efficient and powerful programming. This chip model is capable of meeting the demands of high-performance digital signal processing, embedded processing, and image processing.


The chip model 10AX115H2F34E2LG has several advantages over other models. It is designed with a low-power architecture that allows for improved energy efficiency and better performance. The chip model also has a high-speed processing capability that allows for faster processing of data. Additionally, the chip model is capable of supporting a wide range of input and output formats, making it suitable for a variety of applications.


The expected demand for the chip model 10AX115H2F34E2LG in related industries is expected to continue to grow in the future. This is due to the increasing need for high-performance digital signal processing, embedded processing, and image processing applications. As technology advances, the need for more powerful and efficient processing solutions will continue to grow. This chip model is designed to meet these needs and is expected to remain in high demand in the future.


The original design intention of the chip model 10AX115H2F34E2LG was to provide a low-power, high-speed solution for digital signal processing, embedded processing, and image processing applications. It was designed to be programmed with an HDL language, allowing for more efficient and powerful programming. The chip model is also designed to be upgradable, allowing for future upgrades to be made in order to meet the changing needs of the industry.


The chip model 10AX115H2F34E2LG is also suitable for advanced communication systems. Its high-speed processing capability and low-power architecture make it well-suited to a variety of communication applications. Additionally, its upgradability makes it possible to keep up with the changing needs of the industry and ensure that it is able to meet the demands of advanced communication systems.



2,508 In Stock


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Unit Price: $25,156.8272
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $23,395.8493 $23,395.8493
10+ $23,144.2810 $231,442.8102
100+ $21,886.4397 $2,188,643.9664
1000+ $20,628.5983 $10,314,299.1520
10000+ $18,867.6204 $18,867,620.4000
The price is for reference only, please refer to the actual quotation!

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