
Intel Corporation
10AX115H2F34E2LG
10AX115H2F34E2LG ECAD Model
10AX115H2F34E2LG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 504 | |
Number of Outputs | 504 | |
Number of Logic Cells | 1150000 | |
Number of CLBs | 42720 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 42720 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1152,34X34,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX115H2F34E2LG Datasheet Download
10AX115H2F34E2LG Overview
Chip model 10AX115H2F34E2LG is a high-performance, low-power device that is well-suited to a variety of digital signal processing, embedded processing, and image processing applications. It is designed to be programmed with an HDL language, allowing for more efficient and powerful programming. This chip model is capable of meeting the demands of high-performance digital signal processing, embedded processing, and image processing.
The chip model 10AX115H2F34E2LG has several advantages over other models. It is designed with a low-power architecture that allows for improved energy efficiency and better performance. The chip model also has a high-speed processing capability that allows for faster processing of data. Additionally, the chip model is capable of supporting a wide range of input and output formats, making it suitable for a variety of applications.
The expected demand for the chip model 10AX115H2F34E2LG in related industries is expected to continue to grow in the future. This is due to the increasing need for high-performance digital signal processing, embedded processing, and image processing applications. As technology advances, the need for more powerful and efficient processing solutions will continue to grow. This chip model is designed to meet these needs and is expected to remain in high demand in the future.
The original design intention of the chip model 10AX115H2F34E2LG was to provide a low-power, high-speed solution for digital signal processing, embedded processing, and image processing applications. It was designed to be programmed with an HDL language, allowing for more efficient and powerful programming. The chip model is also designed to be upgradable, allowing for future upgrades to be made in order to meet the changing needs of the industry.
The chip model 10AX115H2F34E2LG is also suitable for advanced communication systems. Its high-speed processing capability and low-power architecture make it well-suited to a variety of communication applications. Additionally, its upgradability makes it possible to keep up with the changing needs of the industry and ensure that it is able to meet the demands of advanced communication systems.
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2,508 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $23,395.8493 | $23,395.8493 |
10+ | $23,144.2810 | $231,442.8102 |
100+ | $21,886.4397 | $2,188,643.9664 |
1000+ | $20,628.5983 | $10,314,299.1520 |
10000+ | $18,867.6204 | $18,867,620.4000 |
The price is for reference only, please refer to the actual quotation! |