Intel Corporation
10AX115H1F34I1SG
10AX115H1F34I1SG ECAD Model
10AX115H1F34I1SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 504 | |
| Number of Outputs | 504 | |
| Number of Logic Cells | 1150000 | |
| Number of CLBs | 42720 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 42720 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX115H1F34I1SG Datasheet Download
10AX115H1F34I1SG Overview
The chip model 10AX115H1F34I1SG is a highly capable processor that is suitable for a variety of applications, such as high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, which is a hardware description language used to design and document digital systems.
The 10AX115H1F34I1SG chip model offers a number of advantages, including its high-performance capabilities, its low power consumption, and its compatibility with a variety of development tools. It also offers a high degree of scalability, allowing users to easily upgrade their system without having to replace the chip.
Due to the increasing demand for high-performance digital signal processing and embedded processing, the 10AX115H1F34I1SG chip model is expected to be in high demand in the future. The chip model is also expected to be used in the development and popularization of future intelligent robots, as it provides the necessary processing power and flexibility for these applications.
In order to effectively use the 10AX115H1F34I1SG chip model, it is important to have an understanding of HDL language and the underlying hardware design principles. Additionally, knowledge of system design and programming is essential in order to make full use of the chip model’s capabilities. With the right skillset, the 10AX115H1F34I1SG chip model can be used to great effect in the development and popularization of future intelligent robots.
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1,024 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $29,117.2691 | $29,117.2691 |
| 10+ | $28,804.1802 | $288,041.8018 |
| 100+ | $27,238.7356 | $2,723,873.5605 |
| 1000+ | $25,673.2910 | $12,836,645.5150 |
| 10000+ | $23,481.6686 | $23,481,668.6250 |
| The price is for reference only, please refer to the actual quotation! | ||