Intel Corporation
10AX115H1F34E1SG
10AX115H1F34E1SG ECAD Model
10AX115H1F34E1SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 504 | |
| Number of Outputs | 504 | |
| Number of Logic Cells | 1150000 | |
| Number of CLBs | 42720 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 42720 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX115H1F34E1SG Datasheet Download
10AX115H1F34E1SG Overview
The chip model 10AX115H1F34E1SG is a highly advanced and powerful chip designed for use in a wide range of applications. It is designed to be a versatile chip capable of handling a variety of tasks, from basic communication systems to more advanced and complex scenarios. The chip is designed to be highly efficient, reliable, and secure, making it an ideal choice for a variety of applications.
The original design intention of the chip model 10AX115H1F34E1SG was to provide a powerful and robust platform for a variety of applications. The chip was designed with a focus on performance, reliability, and security, making it an ideal choice for a variety of applications. The chip is also designed with a focus on scalability and flexibility, allowing for future upgrades and modifications to be made to the chip without compromising its performance.
When it comes to the potential future applications of the chip model 10AX115H1F34E1SG, the possibilities are virtually limitless. The chip is designed to be highly adaptable and can be used in a wide range of applications, from basic communication systems to more advanced and complex scenarios. The chip is also designed to be highly efficient, reliable, and secure, making it an ideal choice for a variety of applications. In addition, the chip is designed to be highly scalable and flexible, allowing for future upgrades and modifications to be made to the chip without compromising its performance.
When it comes to the product description and specific design requirements of the chip model 10AX115H1F34E1SG, the chip is designed to be highly efficient and reliable, making it an ideal choice for a variety of applications. The chip is designed to be highly secure, making it an ideal choice for a variety of applications. The chip is also designed to be highly scalable and flexible, allowing for future upgrades and modifications to be made to the chip without compromising its performance.
There are a number of case studies and best practices that can be used to ensure that the chip model 10AX115H1F34E1SG is used effectively and safely. For example, the chip should be tested and configured properly before it is used in an application. Additionally, the chip should be kept up to date with the latest firmware and software updates to ensure that it is running at its peak performance. Finally, the chip should be monitored and maintained regularly to ensure that it is running optimally.
In conclusion, the chip model 10AX115H1F34E1SG is a highly advanced and powerful chip designed for use in a wide range of applications. The chip is designed to be highly efficient, reliable, and secure, making it an ideal choice for a variety of applications. The chip is also designed with a focus on scalability and flexibility, allowing for future upgrades and modifications to be made to the chip without compromising its performance. Additionally, there are a number of case studies and best practices that can be used to ensure that the chip is used effectively and safely.
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5,738 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $25,480.1892 | $25,480.1892 |
| 10+ | $25,206.2087 | $252,062.0867 |
| 100+ | $23,836.3060 | $2,383,630.6023 |
| 1000+ | $22,466.4034 | $11,233,201.6890 |
| 10000+ | $20,548.5397 | $20,548,539.6750 |
| The price is for reference only, please refer to the actual quotation! | ||