Intel Corporation
10AX090U4F45E3SG
10AX090U4F45E3SG ECAD Model
10AX090U4F45E3SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 480 | |
| Number of Outputs | 480 | |
| Number of Logic Cells | 900000 | |
| Number of CLBs | 33962 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 33962 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1932 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1932 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1932,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1932,44X44,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX090U4F45E3SG Datasheet Download
10AX090U4F45E3SG Overview
The chip model 10AX090U4F45E3SG is a product of the ever-evolving technology industry, and its advantages have made it a popular choice for many industries. It is an integrated circuit that is designed to provide high-performance computing capabilities, and is capable of handling a variety of tasks such as data processing and communication. This chip model is designed to be highly efficient, and its power consumption is much lower than other chips of similar specifications. In addition, the chip is also equipped with a number of features that make it suitable for use in a wide range of applications.
The expected demand for the chip model 10AX090U4F45E3SG is expected to grow in the future as more industries start to use it. This is due to its ability to provide high-performance computing capabilities and its low power consumption. In addition, the chip is also designed to be highly reliable and durable, making it suitable for use in a wide range of industries. Furthermore, the chip is also designed to be upgradeable, allowing it to be used in more advanced applications in the future.
The original design intention of the chip model 10AX090U4F45E3SG is to provide high-performance computing capabilities with low power consumption and high reliability. This makes it suitable for use in a wide range of applications, from basic data processing to complex communication systems. Furthermore, the chip is also designed to be upgradeable, allowing it to be used in more advanced applications in the future. This makes it suitable for use in a variety of scenarios, from basic networking to more advanced communication systems.
The possible future applications of the chip model 10AX090U4F45E3SG are vast and varied. It is suitable for use in a wide range of scenarios, from basic networking to more advanced communication systems. In addition, the chip is also designed to be upgradeable, allowing it to be used in more advanced applications in the future. This makes it suitable for use in a variety of scenarios, from basic networking to more advanced communication systems. Furthermore, the chip may also be applied to a variety of intelligent scenarios in the future, such as artificial intelligence (AI) and machine learning (ML).
The chip model 10AX090U4F45E3SG is an integrated circuit that is designed to provide high-performance computing capabilities, and is capable of handling a variety of tasks such as data processing and communication. It is expected to be in high demand in the future, due to its ability to provide high-performance computing capabilities and its low power consumption. In addition, the chip is also designed to be upgradeable, allowing it to be used in more advanced applications in the future. This makes it suitable for use in a variety of scenarios, from basic networking to more advanced communication systems. Furthermore, the chip may also be applied to a variety of intelligent scenarios in the future, such as artificial intelligence (AI) and machine learning (ML). This makes it suitable for use in the era of fully intelligent systems.
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3,052 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $16,572.9270 | $16,572.9270 |
| 10+ | $16,394.7235 | $163,947.2347 |
| 100+ | $15,503.7059 | $1,550,370.5892 |
| 1000+ | $14,612.6883 | $7,306,344.1560 |
| 10000+ | $13,365.2637 | $13,365,263.7000 |
| The price is for reference only, please refer to the actual quotation! | ||