Intel Corporation
10AX090U4F45E3LG
10AX090U4F45E3LG ECAD Model
10AX090U4F45E3LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 480 | |
| Number of Outputs | 480 | |
| Number of Logic Cells | 900000 | |
| Number of CLBs | 33962 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 33962 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1932 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1932 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1932,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1932,44X44,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX090U4F45E3LG Datasheet Download
10AX090U4F45E3LG Overview
The chip model 10AX090U4F45E3LG is a cutting-edge product in the semiconductor industry that offers a wide range of benefits to its users. This chip model is developed by a leading semiconductor manufacturer and is known for its high performance, low power consumption, and its ability to be easily integrated into various systems.
The chip model 10AX090U4F45E3LG is expected to be in high demand in the coming years, especially in the fields of networking and computing. This chip model is designed to be used in a wide range of applications, such as in the Internet of Things (IoT), cloud computing, artificial intelligence (AI), and 5G networks. With its low power consumption and high performance, this chip model can be used to power many of the devices and systems that are being developed today.
The chip model 10AX090U4F45E3LG is also expected to play a major role in the development and popularization of future intelligent robots. This chip model is capable of supporting a wide range of intelligent scenarios, such as facial recognition, object recognition, and natural language processing. This chip model can also be used in the development of fully intelligent systems, such as autonomous vehicles and robots.
In order to use the chip model 10AX090U4F45E3LG effectively, it is necessary to have certain technical skills. These skills include knowledge of digital circuit design, embedded systems, and software engineering. Additionally, knowledge of artificial intelligence and machine learning algorithms is also necessary in order to be able to effectively use this chip model.
Overall, the chip model 10AX090U4F45E3LG is a cutting-edge product in the semiconductor industry that offers a wide range of benefits to its users. This chip model is expected to be in high demand in the coming years, especially in the fields of networking and computing. It is also capable of supporting a wide range of intelligent scenarios and can be used in the development of fully intelligent systems. In order to use this chip model effectively, it is necessary to have certain technical skills.
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2,536 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $20,715.4055 | $20,715.4055 |
| 10+ | $20,492.6592 | $204,926.5923 |
| 100+ | $19,378.9278 | $1,937,892.7752 |
| 1000+ | $18,265.1963 | $9,132,598.1360 |
| 10000+ | $16,705.9722 | $16,705,972.2000 |
| The price is for reference only, please refer to the actual quotation! | ||