Intel Corporation
10AX090U2F45E2SG
10AX090U2F45E2SG ECAD Model
10AX090U2F45E2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 480 | |
| Number of Outputs | 480 | |
| Number of Logic Cells | 900000 | |
| Number of CLBs | 33962 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 33962 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1932 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1932 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1932,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1932,44X44,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX090U2F45E2SG Datasheet Download
10AX090U2F45E2SG Overview
The chip model 10AX090U2F45E2SG is a powerful and versatile choice for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with HDL language, which is the language of choice for many engineers due to its flexibility and scalability.
The chip model 10AX090U2F45E2SG offers several advantages, including high performance, low power consumption, and small size. This makes it an ideal choice for a variety of applications, including industrial automation, automotive, and medical devices. Additionally, its ability to be programmed in HDL language allows for greater flexibility and scalability. As a result, the demand for this chip model is expected to continue to grow in the coming years.
In terms of future applications, the chip model 10AX090U2F45E2SG has the potential to be used in networks and other intelligent scenarios. It can be used to enhance the performance of networks, as well as to enable more efficient communication between devices. Additionally, it could be used in the era of fully intelligent systems, such as those used in autonomous vehicles or industrial robots. This chip model has the potential to revolutionize the way we interact with technology.
In conclusion, the chip model 10AX090U2F45E2SG is a powerful and versatile choice for a variety of applications. It offers many advantages, such as high performance, low power consumption, and small size, and it can be programmed in HDL language for greater flexibility and scalability. Furthermore, it has the potential to be used in networks and other intelligent scenarios, as well as in the era of fully intelligent systems. As a result, the demand for this chip model is expected to continue to grow in the coming years.
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2,408 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $23,863.6068 | $23,863.6068 |
| 10+ | $23,607.0089 | $236,070.0892 |
| 100+ | $22,324.0193 | $2,232,401.9301 |
| 1000+ | $21,041.0297 | $10,520,514.8430 |
| 10000+ | $19,244.8442 | $19,244,844.2250 |
| The price is for reference only, please refer to the actual quotation! | ||