Intel Corporation
10AX090U2F45E1SG
10AX090U2F45E1SG ECAD Model
10AX090U2F45E1SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 480 | |
| Number of Outputs | 480 | |
| Number of Logic Cells | 900000 | |
| Number of CLBs | 33962 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 33962 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1932 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1932 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1932,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1932,44X44,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX090U2F45E1SG Datasheet Download
10AX090U2F45E1SG Overview
The chip model 10AX090U2F45E1SG is a high-performance, low-power integrated circuit (IC) that has been developed to meet the needs of a wide range of applications. It offers a variety of features and benefits that make it ideal for use in a variety of industries. Its advanced design, low-power consumption, and high-speed performance make it an attractive choice for many applications.
The industry trends of the chip model 10AX090U2F45E1SG are rapidly changing. As technology continues to evolve, the demand for the chip model 10AX090U2F45E1SG is expected to grow significantly. This is due to its ability to provide high-performance, low-power solutions that can be used in a variety of applications. This chip model is also expected to be used in the development and popularization of future intelligent robots.
The chip model 10AX090U2F45E1SG offers a number of advantages over other chip models. It has a low-power consumption and high-speed performance, making it an attractive choice for many applications. Additionally, its advanced design allows for a variety of features and benefits that make it ideal for use in a variety of industries.
The application environment of the chip model 10AX090U2F45E1SG may require the support of new technologies in order to be used effectively. This may include the use of artificial intelligence, machine learning, and other advanced technologies. Additionally, the use of this chip model may also require the use of specific technical talents in order to use it effectively.
In conclusion, the chip model 10AX090U2F45E1SG is a high-performance, low-power integrated circuit that has a number of advantages over other chip models. It is expected to be used in a variety of industries and is expected to grow in demand in the future. Additionally, it may require the use of new technologies and specific technical talents in order to be used effectively.
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3,918 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $6,376.0800 | $6,376.0800 |
| 10+ | $6,307.5200 | $63,075.2000 |
| 100+ | $5,964.7200 | $596,472.0000 |
| 1000+ | $5,621.9200 | $2,810,960.0000 |
| 10000+ | $5,142.0000 | $5,142,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||