Intel Corporation
10AX090U1F45E1SG
10AX090U1F45E1SG ECAD Model
10AX090U1F45E1SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 480 | |
| Number of Outputs | 480 | |
| Number of Logic Cells | 900000 | |
| Number of CLBs | 33962 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 33962 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1932 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1932 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1932,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1932,44X44,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX090U1F45E1SG Datasheet Download
10AX090U1F45E1SG Overview
Chip model 10AX090U1F45E1SG is a high-performance chip designed for various applications. It is developed by a leading semiconductor company, and is widely used in different industries. It is a highly efficient chip, with a wide range of features, including high-speed data processing, low power consumption, and high reliability.
The chip model 10AX090U1F45E1SG has been designed to meet the increasing demand for high-performance chips. It is capable of providing high-speed data processing, low power consumption, and high reliability. In addition, the chip model 10AX090U1F45E1SG is also capable of supporting advanced communication systems. It is suitable for various applications, including industrial, automotive, consumer electronics, and communications.
The industry trends of the chip model 10AX090U1F45E1SG and the future development of related industries depend on the specific technologies needed. It is possible to upgrade the chip model 10AX090U1F45E1SG to meet the demands of future applications. For example, it could be used in networks to support intelligent scenarios such as artificial intelligence and machine learning. It is also possible to use the chip model 10AX090U1F45E1SG in the era of fully intelligent systems, such as self-driving vehicles and intelligent homes.
In conclusion, the chip model 10AX090U1F45E1SG is a high-performance chip that is suitable for a wide range of applications. It has the capability to support advanced communication systems and is capable of being upgraded to meet the demands of future applications. It is possible to use the chip model 10AX090U1F45E1SG in networks to support intelligent scenarios, and it can also be used in the era of fully intelligent systems.
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5,344 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $7,438.5544 | $7,438.5544 |
| 10+ | $7,358.5700 | $73,585.6995 |
| 100+ | $6,958.6477 | $695,864.7672 |
| 1000+ | $6,558.7254 | $3,279,362.6960 |
| 10000+ | $5,998.8342 | $5,998,834.2000 |
| The price is for reference only, please refer to the actual quotation! | ||