
Intel Corporation
10AX090S3F45E2LG
10AX090S3F45E2LG ECAD Model
10AX090S3F45E2LG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 624 | |
Number of Outputs | 624 | |
Number of Logic Cells | 900000 | |
Number of CLBs | 33962 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 33962 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1932 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1932 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1932,44X44,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 45 mm | |
Length | 45 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1932,44X44,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX090S3F45E2LG Datasheet Download
10AX090S3F45E2LG Overview
The chip model 10AX090S3F45E2LG is a high-performance, low-power and cost-efficient chip that has been gaining popularity in the market as a reliable solution for a range of industries. This model provides superior performance and features, such as high-speed data processing, advanced power management and high-quality audio and video output. It is also designed to be compatible with a wide range of operating systems and applications.
The chip model 10AX090S3F45E2LG has numerous advantages that make it an attractive solution for a variety of industries. Its low power consumption and high performance make it ideal for applications that require high-speed data processing and other advanced features. Additionally, its compatibility with a wide range of operating systems and applications makes it a great choice for companies looking to integrate their products with existing systems. Its cost-efficiency also makes it an attractive choice for businesses that need to keep their overhead costs low.
As the demand for high-performance, low-power chips continues to grow, the chip model 10AX090S3F45E2LG is expected to be in high demand in the future. Its low power consumption and high performance make it an ideal choice for a variety of applications, such as networking and machine learning. Additionally, its compatibility with a wide range of operating systems and applications make it a great choice for companies looking to integrate their products with existing systems.
The chip model 10AX090S3F45E2LG has specific design requirements that must be taken into account when selecting the chip. Its low power consumption and high performance make it an ideal choice for applications that require high-speed data processing and other advanced features. Additionally, its compatibility with a wide range of operating systems and applications make it a great choice for companies looking to integrate their products with existing systems. Additionally, its cost-efficiency makes it an attractive choice for businesses that need to keep their overhead costs low.
Several case studies have been conducted on the chip model 10AX090S3F45E2LG to determine its effectiveness in various applications. One such study found that the chip was able to provide superior performance and features in a variety of networking applications. Additionally, the chip was found to be a reliable solution for machine learning applications, providing superior performance and features.
When using the chip model 10AX090S3F45E2LG, there are certain precautions that should be taken. For example, the chip should not be exposed to extreme temperatures or humidity, as this may cause it to malfunction. Additionally, the chip should be inspected regularly to ensure that it is functioning properly. Finally, the chip should be installed properly to ensure that it functions correctly.
Overall, the chip model 10AX090S3F45E2LG is a high-performance, low-power and cost-efficient chip that is expected to be in high demand in the future. Its low power consumption and high performance make it an ideal choice for a variety of applications, such as networking and machine learning. Additionally, its compatibility with a wide range of operating systems and applications make it a great choice for companies looking to integrate their products with existing systems. Finally, its cost-efficiency makes it an attractive choice for businesses that need to keep their overhead costs low.
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5,901 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $5,437.1594 | $5,437.1594 |
10+ | $5,378.6954 | $53,786.9536 |
100+ | $5,086.3750 | $508,637.4960 |
1000+ | $4,794.0546 | $2,397,027.2800 |
10000+ | $4,384.8060 | $4,384,806.0000 |
The price is for reference only, please refer to the actual quotation! |