10AX090S3F45E2LG
10AX090S3F45E2LG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AX090S3F45E2LG


10AX090S3F45E2LG
F18-10AX090S3F45E2LG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1932,44X44,40
BGA, BGA1932,44X44,40

10AX090S3F45E2LG ECAD Model


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10AX090S3F45E2LG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 624
Number of Outputs 624
Number of Logic Cells 900000
Number of CLBs 33962
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology TSMC
Organization 33962 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1932
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1932
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1932,44X44,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 45 mm
Length 45 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1932,44X44,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AX090S3F45E2LG Datasheet Download


10AX090S3F45E2LG Overview



The chip model 10AX090S3F45E2LG is a high-performance, low-power and cost-efficient chip that has been gaining popularity in the market as a reliable solution for a range of industries. This model provides superior performance and features, such as high-speed data processing, advanced power management and high-quality audio and video output. It is also designed to be compatible with a wide range of operating systems and applications.


The chip model 10AX090S3F45E2LG has numerous advantages that make it an attractive solution for a variety of industries. Its low power consumption and high performance make it ideal for applications that require high-speed data processing and other advanced features. Additionally, its compatibility with a wide range of operating systems and applications makes it a great choice for companies looking to integrate their products with existing systems. Its cost-efficiency also makes it an attractive choice for businesses that need to keep their overhead costs low.


As the demand for high-performance, low-power chips continues to grow, the chip model 10AX090S3F45E2LG is expected to be in high demand in the future. Its low power consumption and high performance make it an ideal choice for a variety of applications, such as networking and machine learning. Additionally, its compatibility with a wide range of operating systems and applications make it a great choice for companies looking to integrate their products with existing systems.


The chip model 10AX090S3F45E2LG has specific design requirements that must be taken into account when selecting the chip. Its low power consumption and high performance make it an ideal choice for applications that require high-speed data processing and other advanced features. Additionally, its compatibility with a wide range of operating systems and applications make it a great choice for companies looking to integrate their products with existing systems. Additionally, its cost-efficiency makes it an attractive choice for businesses that need to keep their overhead costs low.


Several case studies have been conducted on the chip model 10AX090S3F45E2LG to determine its effectiveness in various applications. One such study found that the chip was able to provide superior performance and features in a variety of networking applications. Additionally, the chip was found to be a reliable solution for machine learning applications, providing superior performance and features.


When using the chip model 10AX090S3F45E2LG, there are certain precautions that should be taken. For example, the chip should not be exposed to extreme temperatures or humidity, as this may cause it to malfunction. Additionally, the chip should be inspected regularly to ensure that it is functioning properly. Finally, the chip should be installed properly to ensure that it functions correctly.


Overall, the chip model 10AX090S3F45E2LG is a high-performance, low-power and cost-efficient chip that is expected to be in high demand in the future. Its low power consumption and high performance make it an ideal choice for a variety of applications, such as networking and machine learning. Additionally, its compatibility with a wide range of operating systems and applications make it a great choice for companies looking to integrate their products with existing systems. Finally, its cost-efficiency makes it an attractive choice for businesses that need to keep their overhead costs low.



5,901 In Stock


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Unit Price: $5,846.408
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $5,437.1594 $5,437.1594
10+ $5,378.6954 $53,786.9536
100+ $5,086.3750 $508,637.4960
1000+ $4,794.0546 $2,397,027.2800
10000+ $4,384.8060 $4,384,806.0000
The price is for reference only, please refer to the actual quotation!

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