Intel Corporation
10AX090S2F45I1SG
10AX090S2F45I1SG ECAD Model
10AX090S2F45I1SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 624 | |
| Number of Outputs | 624 | |
| Number of Logic Cells | 900000 | |
| Number of CLBs | 33962 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 33962 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1932 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1932 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1932,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1932,44X44,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX090S2F45I1SG Datasheet Download
10AX090S2F45I1SG Overview
The chip model 10AX090S2F45I1SG is a high-performance chip that is suitable for a variety of applications, such as digital signal processing, embedded processing, and image processing. It requires the use of HDL language for programming and development.
The 10AX090S2F45I1SG chip is a powerful tool for developing and implementing advanced applications. It offers a wide range of features, including high-speed processing, low power consumption, and a wide range of I/O capabilities. The chip is also suitable for the development of future intelligent robots, as it provides the necessary computing power and flexibility to enable the development of sophisticated robotic systems.
The industry trends of the 10AX090S2F45I1SG chip and the future development of related industries are dependent on the specific technologies and applications that are needed. For example, new technologies such as artificial intelligence, machine learning, and edge computing will be necessary for the development of future intelligent robots.
In order to use the 10AX090S2F45I1SG chip effectively, technical talents with knowledge and experience in HDL programming, digital signal processing, embedded systems, image processing, and artificial intelligence are needed. These talents should also have a good understanding of the industry trends and the future development of related industries.
In conclusion, the chip model 10AX090S2F45I1SG is a powerful tool for developing and implementing advanced applications, and it is suitable for the development of future intelligent robots. To use it effectively, technical talents with knowledge and experience in HDL programming, digital signal processing, embedded systems, image processing, and artificial intelligence are needed. The industry trends and the future development of related industries are dependent on the specific technologies and applications that are needed.
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1,758 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $27,629.1341 | $27,629.1341 |
| 10+ | $27,332.0466 | $273,320.4660 |
| 100+ | $25,846.6093 | $2,584,660.9281 |
| 1000+ | $24,361.1720 | $12,180,585.9830 |
| 10000+ | $22,281.5597 | $22,281,559.7250 |
| The price is for reference only, please refer to the actual quotation! | ||