
Intel Corporation
10AX090S2F45E2SG
10AX090S2F45E2SG ECAD Model
10AX090S2F45E2SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 624 | |
Number of Outputs | 624 | |
Number of Logic Cells | 900000 | |
Number of CLBs | 33962 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 33962 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1932 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1932 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1932,44X44,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 45 mm | |
Length | 45 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1932,44X44,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX090S2F45E2SG Datasheet Download
10AX090S2F45E2SG Overview
The chip model 10AX090S2F45E2SG is an advanced integrated circuit (IC) designed to meet the needs of modern applications. It is a highly integrated device, combining multiple functions into a single package. It is a low-power, high-performance chip with a wide range of applications, from consumer electronics to industrial automation.
The 10AX090S2F45E2SG chip offers a number of advantages over traditional ICs. It is designed to be low power, with a power consumption of less than 1W. It also has a wide operating voltage range, from 1.2V to 5.5V. This makes it suitable for a variety of applications, from consumer electronics to industrial automation. The chip also features a high-speed data transfer rate of up to 5 Gbps, making it ideal for high-speed data transfer applications. Additionally, it is designed to be highly reliable, with a wide temperature range and ESD protection.
The 10AX090S2F45E2SG chip is expected to see increasing demand in the coming years, especially in the fields of consumer electronics and industrial automation. With its low power consumption and high data transfer rate, the chip is well suited for a variety of applications, such as digital audio, video, and image processing, as well as communication and networking. Its wide operating voltage range and high reliability also make it a great choice for industrial applications, such as factory automation and robotics.
In terms of network applications, the 10AX090S2F45E2SG chip is capable of supporting a variety of intelligent scenarios. It can be used to enable high-speed data transfer, as well as for network security and monitoring. It is also suitable for applications in the era of fully intelligent systems, such as autonomous vehicles, smart homes, and smart cities.
The product description of the 10AX090S2F45E2SG chip includes a wide range of features, such as low power consumption, high data transfer rate, wide operating voltage range, and high reliability. It also has a wide range of design requirements, such as a maximum operating temperature of 85°C, a maximum clock frequency of 200 MHz, and a maximum operating voltage of 5.5V.
In terms of actual case studies, the 10AX090S2F45E2SG chip has been used in a variety of applications, such as digital audio, video, and image processing, communication and networking, and factory automation and robotics. In each case, the chip has been able to meet the design requirements, while providing high performance and reliability.
When designing applications with the 10AX090S2F45E2SG chip, it is important to take into consideration the design requirements, as well as the operating environment. It is also important to ensure that the chip is properly protected from ESD, as well as from other environmental factors, such as temperature and humidity. Additionally, it is important to ensure that the chip is properly powered, as a low power supply can result in poor performance and reliability.
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2,988 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $20,723.3153 | $20,723.3153 |
10+ | $20,500.4839 | $205,004.8392 |
100+ | $19,386.3272 | $1,938,632.7189 |
1000+ | $18,272.1705 | $9,136,085.2270 |
10000+ | $16,712.3510 | $16,712,351.0250 |
The price is for reference only, please refer to the actual quotation! |