10AX090S2F45E2SG
10AX090S2F45E2SG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AX090S2F45E2SG


10AX090S2F45E2SG
F18-10AX090S2F45E2SG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1932,44X44,40
BGA, BGA1932,44X44,40

10AX090S2F45E2SG ECAD Model


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10AX090S2F45E2SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 624
Number of Outputs 624
Number of Logic Cells 900000
Number of CLBs 33962
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology TSMC
Organization 33962 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1932
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1932
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1932,44X44,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 45 mm
Length 45 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1932,44X44,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AX090S2F45E2SG Datasheet Download


10AX090S2F45E2SG Overview



The chip model 10AX090S2F45E2SG is an advanced integrated circuit (IC) designed to meet the needs of modern applications. It is a highly integrated device, combining multiple functions into a single package. It is a low-power, high-performance chip with a wide range of applications, from consumer electronics to industrial automation.


The 10AX090S2F45E2SG chip offers a number of advantages over traditional ICs. It is designed to be low power, with a power consumption of less than 1W. It also has a wide operating voltage range, from 1.2V to 5.5V. This makes it suitable for a variety of applications, from consumer electronics to industrial automation. The chip also features a high-speed data transfer rate of up to 5 Gbps, making it ideal for high-speed data transfer applications. Additionally, it is designed to be highly reliable, with a wide temperature range and ESD protection.


The 10AX090S2F45E2SG chip is expected to see increasing demand in the coming years, especially in the fields of consumer electronics and industrial automation. With its low power consumption and high data transfer rate, the chip is well suited for a variety of applications, such as digital audio, video, and image processing, as well as communication and networking. Its wide operating voltage range and high reliability also make it a great choice for industrial applications, such as factory automation and robotics.


In terms of network applications, the 10AX090S2F45E2SG chip is capable of supporting a variety of intelligent scenarios. It can be used to enable high-speed data transfer, as well as for network security and monitoring. It is also suitable for applications in the era of fully intelligent systems, such as autonomous vehicles, smart homes, and smart cities.


The product description of the 10AX090S2F45E2SG chip includes a wide range of features, such as low power consumption, high data transfer rate, wide operating voltage range, and high reliability. It also has a wide range of design requirements, such as a maximum operating temperature of 85°C, a maximum clock frequency of 200 MHz, and a maximum operating voltage of 5.5V.


In terms of actual case studies, the 10AX090S2F45E2SG chip has been used in a variety of applications, such as digital audio, video, and image processing, communication and networking, and factory automation and robotics. In each case, the chip has been able to meet the design requirements, while providing high performance and reliability.


When designing applications with the 10AX090S2F45E2SG chip, it is important to take into consideration the design requirements, as well as the operating environment. It is also important to ensure that the chip is properly protected from ESD, as well as from other environmental factors, such as temperature and humidity. Additionally, it is important to ensure that the chip is properly powered, as a low power supply can result in poor performance and reliability.



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Unit Price: $22,283.1347
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $20,723.3153 $20,723.3153
10+ $20,500.4839 $205,004.8392
100+ $19,386.3272 $1,938,632.7189
1000+ $18,272.1705 $9,136,085.2270
10000+ $16,712.3510 $16,712,351.0250
The price is for reference only, please refer to the actual quotation!

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