Intel Corporation
10AX090S1F45E1SG
10AX090S1F45E1SG ECAD Model
10AX090S1F45E1SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 624 | |
| Number of Outputs | 624 | |
| Number of Logic Cells | 900000 | |
| Number of CLBs | 33962 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 33962 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1932 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1932 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1932,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1932,44X44,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX090S1F45E1SG Datasheet Download
10AX090S1F45E1SG Overview
In recent years, the development of semiconductor technology has been advancing rapidly, and chip model 10AX090S1F45E1SG has become a popular choice for many industries. This chip model is equipped with a variety of features that make it suitable for a wide range of applications. It is a powerful and reliable chip model that can be used in many different fields.
The chip model 10AX090S1F45E1SG has a number of advantages that make it attractive to many industries. It is an energy-efficient chip model that can be used to reduce energy consumption. It also has a high level of integration, which makes it suitable for a wide range of applications. Furthermore, it has a high level of performance, which makes it suitable for high-end applications.
In addition, the chip model 10AX090S1F45E1SG is expected to have a growing demand in the future. This is due to its ability to meet the needs of various industries. For example, it can be used in the automotive industry for the development of autonomous vehicles. It can also be used in the healthcare industry for medical device development. Furthermore, it can be used in the industrial automation industry for the development of robots and other automated systems.
The chip model 10AX090S1F45E1SG is also expected to have potential applications in networks and intelligent scenarios in the future. For example, it can be used in the development of 5G networks to provide high-speed and reliable connections. Furthermore, it can be used in the development of intelligent systems such as the Internet of Things (IoT) and artificial intelligence (AI). These systems are expected to be used in a wide range of applications, such as smart homes and smart cities.
In conclusion, the chip model 10AX090S1F45E1SG has many advantages that make it an attractive choice for many industries. It is expected to have a growing demand in the future due to its ability to meet the needs of various industries. Furthermore, it is expected to have potential applications in networks and intelligent scenarios in the future. Therefore, it is possible that the chip model 10AX090S1F45E1SG will be used in the era of fully intelligent systems.
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4,675 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $28,204.3298 | $28,204.3298 |
| 10+ | $27,901.0574 | $279,010.5740 |
| 100+ | $26,384.6956 | $2,638,469.5581 |
| 1000+ | $24,868.3338 | $12,434,166.8830 |
| 10000+ | $22,745.4272 | $22,745,427.2250 |
| The price is for reference only, please refer to the actual quotation! | ||