10AX090R4F40I3SG
10AX090R4F40I3SG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AX090R4F40I3SG


10AX090R4F40I3SG
F18-10AX090R4F40I3SG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1517,39X39,40
BGA, BGA1517,39X39,40

10AX090R4F40I3SG ECAD Model


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10AX090R4F40I3SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 342
Number of Outputs 342
Number of Logic Cells 900000
Number of CLBs 33962
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology TSMC
Organization 33962 CLBS
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1517
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1517,39X39,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1517,39X39,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AX090R4F40I3SG Datasheet Download


10AX090R4F40I3SG Overview



The chip model 10AX090R4F40I3SG is a cutting-edge, high-performance integrated circuit (IC) designed for advanced communication systems. The original design intention of this chip was to provide a reliable, efficient and cost-effective solution for communication networks. It is capable of supporting a wide range of applications, including wireless communication, data transmission, and network security.


This chip model has been designed with the latest technologies and techniques, such as advanced signal processing, digital signal processing, and power management. It is also designed with the latest security protocols and encryption algorithms, making it an ideal choice for secure communication. Furthermore, it is capable of supporting a wide range of communication protocols, such as Ethernet, WiFi, Bluetooth, and Zigbee.


The chip model 10AX090R4F40I3SG is capable of being applied to the current and future intelligent systems. It is capable of supporting a wide range of intelligent scenarios, such as voice recognition, facial recognition, and natural language processing. It is also capable of supporting advanced communication protocols, such as 5G and 6G. Furthermore, it is capable of supporting the latest security protocols and encryption algorithms, making it an ideal choice for secure communication.


In order to ensure that the chip model 10AX090R4F40I3SG meets the needs of advanced communication systems, it has been designed with specific requirements in mind. It is designed to be highly efficient and cost-effective, while also being able to support a wide range of communication protocols. Furthermore, it is designed to be secure, reliable, and capable of supporting the latest security protocols and encryption algorithms.


In addition to the design requirements, there are also several case studies that have been conducted on the chip model 10AX090R4F40I3SG. These case studies have demonstrated its capabilities in various areas, such as wireless communication, data transmission, and network security. Furthermore, these case studies have also provided valuable insights into the possible future applications of this chip model in networks and intelligent systems.


When using the chip model 10AX090R4F40I3SG, it is important to take certain precautions. For example, it should be used in accordance with the manufacturer's instructions and in accordance with the applicable safety regulations. Furthermore, it should be tested and verified regularly to ensure that it is working correctly. Finally, it should be used in a secure environment, such as a secure network or a secure data center.


In conclusion, the chip model 10AX090R4F40I3SG is a cutting-edge, high-performance IC designed for advanced communication systems. It is capable of supporting a wide range of applications, including wireless communication, data transmission, and network security. Furthermore, it is capable of being applied to the current and future intelligent systems, and it is designed with the latest security protocols and encryption algorithms. The product description and design requirements of this chip model, as well as the case studies and precautions, should be taken into account when using it.



3,478 In Stock


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Unit Price: $4,090.4027
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $3,804.0745 $3,804.0745
10+ $3,763.1705 $37,631.7048
100+ $3,558.6503 $355,865.0349
1000+ $3,354.1302 $1,677,065.1070
10000+ $3,067.8020 $3,067,802.0250
The price is for reference only, please refer to the actual quotation!

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