Intel Corporation
10AX090R4F40E3SG
10AX090R4F40E3SG ECAD Model
10AX090R4F40E3SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 342 | |
| Number of Outputs | 342 | |
| Number of Logic Cells | 900000 | |
| Number of CLBs | 33962 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 33962 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX090R4F40E3SG Datasheet Download
10AX090R4F40E3SG Overview
The chip model 10AX090R4F40E3SG is a highly advanced integrated circuit that is used for a variety of applications. Developed by a leading semiconductor manufacturer, this chip model is designed to provide a reliable and efficient solution for various communication systems. It is capable of providing a high-speed data transfer rate and is also capable of handling large amounts of data.
The chip model 10AX090R4F40E3SG has a number of advantages over other models. It is designed to be more power-efficient, allowing for a longer battery life in mobile devices. It is also designed to be more reliable and robust, making it suitable for use in a wide range of applications. Additionally, it is designed to be more flexible, allowing for easy integration into existing systems.
The chip model 10AX090R4F40E3SG is expected to be in high demand in the near future. This is due to the increasing demand for advanced communication systems in the modern world. As the world becomes more connected, the need for reliable and efficient communication systems increases. The chip model 10AX090R4F40E3SG is well-suited to meet this demand, as it is designed for high-speed data transfer and can handle large amounts of data.
The original design intention of the chip model 10AX090R4F40E3SG was to provide an efficient and reliable solution for communication systems. It is also designed to be easily upgradeable, allowing for future upgrades as needed. This makes it a great choice for those looking for a reliable and efficient solution for their communication needs.
The chip model 10AX090R4F40E3SG is also capable of being used in advanced communication systems. It is designed to be compatible with a wide range of networks and can be used in a variety of intelligent scenarios. This makes it a great choice for those looking to use the latest technology in their communication systems.
The chip model 10AX090R4F40E3SG is also expected to be useful in the era of fully intelligent systems. As the world moves towards a more connected and intelligent future, the need for reliable and efficient communication systems increases. This chip model is designed to be compatible with a wide range of networks and can be used in a variety of intelligent scenarios. This makes it a great choice for those looking to use the latest technology in their communication systems.
In conclusion, the chip model 10AX090R4F40E3SG is a highly advanced integrated circuit that is designed to provide a reliable and efficient solution for various communication systems. It is expected to be in high demand in the near future due to the increasing demand for advanced communication systems. Additionally, it is designed to be easily upgradeable and can be used in a variety of intelligent scenarios, making it a great choice for those looking to use the latest technology in their communication systems.
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5,950 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $13,845.7314 | $13,845.7314 |
| 10+ | $13,696.8525 | $136,968.5254 |
| 100+ | $12,952.4584 | $1,295,245.8384 |
| 1000+ | $12,208.0642 | $6,104,032.1120 |
| 10000+ | $11,165.9124 | $11,165,912.4000 |
| The price is for reference only, please refer to the actual quotation! | ||