Intel Corporation
10AX090R3F40I2SG
10AX090R3F40I2SG ECAD Model
10AX090R3F40I2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 342 | |
| Number of Outputs | 342 | |
| Number of Logic Cells | 900000 | |
| Number of CLBs | 33962 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 33962 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX090R3F40I2SG Datasheet Download
10AX090R3F40I2SG Overview
The chip model 10AX090R3F40I2SG is a multi-function chip that has been widely used in the current industry. It has a wide range of applications, such as in the automotive, industrial, and consumer electronics markets. As a result, the model 10AX090R3F40I2SG has become a standard for many devices and systems.
The chip model 10AX090R3F40I2SG is designed to be highly reliable and efficient. It is designed to be able to handle a wide range of tasks, from basic computing to more complex tasks such as image processing and machine learning. The chip model 10AX090R3F40I2SG also has the ability to integrate with other components and systems to create a more comprehensive solution.
As the industry continues to evolve, the chip model 10AX090R3F40I2SG will need to be upgraded in order to keep up with the latest trends. This means that the chip model 10AX090R3F40I2SG will need to be able to support new technologies and features. For example, as networks become more complex, the chip model 10AX090R3F40I2SG will need to be able to support new communication protocols and encryption standards.
In addition, the chip model 10AX090R3F40I2SG can be used in intelligent scenarios, such as edge computing and autonomous systems. This means that the chip model 10AX090R3F40I2SG can be used to process data from multiple sensors and devices, allowing for more efficient and accurate decision-making. As the industry moves towards a fully intelligent future, the chip model 10AX090R3F40I2SG will need to be able to support the latest technologies and features.
Overall, the chip model 10AX090R3F40I2SG is a highly reliable and efficient chip that has been widely used in the current industry. As the industry continues to evolve, the chip model 10AX090R3F40I2SG will need to be upgraded in order to keep up with the latest trends. In addition, the chip model 10AX090R3F40I2SG can be used in intelligent scenarios, such as edge computing and autonomous systems. This means that the chip model 10AX090R3F40I2SG is an important part of the future of the industry and will need to be able to support the latest technologies and features.
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4,623 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $21,319.7679 | $21,319.7679 |
| 10+ | $21,090.5231 | $210,905.2307 |
| 100+ | $19,944.2990 | $1,994,429.8992 |
| 1000+ | $18,798.0749 | $9,399,037.4560 |
| 10000+ | $17,193.3612 | $17,193,361.2000 |
| The price is for reference only, please refer to the actual quotation! | ||