Intel Corporation
10AX090R3F40I2LG
10AX090R3F40I2LG ECAD Model
10AX090R3F40I2LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 342 | |
| Number of Outputs | 342 | |
| Number of Logic Cells | 900000 | |
| Number of CLBs | 33962 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 33962 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX090R3F40I2LG Datasheet Download
10AX090R3F40I2LG Overview
The 10AX090R3F40I2LG chip model is a product of the latest technology breakthroughs in the field of semiconductor technology. It is a highly advanced system-on-chip (SoC) that can be used for a variety of applications, including communication systems, networks, and intelligent scenarios.
The original design intention of the 10AX090R3F40I2LG chip model was to provide an efficient and reliable platform for the development of advanced communication systems. It was designed to be a powerful and versatile processor that could be used in a wide range of applications, from basic data processing to complex network management. The chip model is capable of performing multiple tasks simultaneously and provides a high level of performance and scalability.
The 10AX090R3F40I2LG chip model is also suitable for use in the future of intelligent systems. It has the potential to be used in the development and popularization of future intelligent robots. It is a powerful processor that can be used to process complex algorithms and data sets, which can enable intelligent robots to make decisions and carry out tasks autonomously.
In order to use the 10AX090R3F40I2LG chip model effectively, it is important to have a good understanding of its features and capabilities. Technical skills such as programming, data analysis, and artificial intelligence are essential for the successful use of this chip model. Additionally, knowledge of the latest developments in the field of semiconductor technology is also important.
The 10AX090R3F40I2LG chip model is a powerful and versatile processor that is capable of providing a high level of performance and scalability. It is suitable for use in a wide range of applications, from basic data processing to complex network management. It also has the potential to be used in the development and popularization of future intelligent robots. With the right technical skills and knowledge, this chip model can be used to create powerful and intelligent systems.
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2,840 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $26,654.8547 | $26,654.8547 |
| 10+ | $26,368.2434 | $263,682.4337 |
| 100+ | $24,935.1867 | $2,493,518.6667 |
| 1000+ | $23,502.1300 | $11,751,064.9810 |
| 10000+ | $21,495.8506 | $21,495,850.5750 |
| The price is for reference only, please refer to the actual quotation! | ||