Intel Corporation
10AX090R2F40I1SG
10AX090R2F40I1SG ECAD Model
10AX090R2F40I1SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 342 | |
| Number of Outputs | 342 | |
| Number of Logic Cells | 900000 | |
| Number of CLBs | 33962 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 33962 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1517 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX090R2F40I1SG Datasheet Download
10AX090R2F40I1SG Overview
The chip model 10AX090R2F40I1SG is a high-performance digital signal processing, embedded processing and image processing system. It is developed by a leading semiconductor company and is designed for use with HDL language. This model is based on the company’s original design intention to provide a reliable and efficient solution for customers with advanced communication systems needs.
The 10AX090R2F40I1SG chip model is equipped with powerful features that can be used in many applications, including digital signal processing, embedded processing, image processing, and more. It is also capable of being upgraded and adapted to new technologies, making it a great choice for future applications. The chip model is also suitable for the development and popularization of future intelligent robots, as it can be used to process large amounts of data quickly and accurately.
In order to use the 10AX090R2F40I1SG chip model effectively, it requires a certain level of technical knowledge and expertise. This includes a basic understanding of HDL language, as well as the ability to interpret and manipulate data. Additionally, knowledge of advanced communication systems and robotics is also beneficial. With the correct skillset, the 10AX090R2F40I1SG chip model can be used to create powerful and efficient solutions for various applications.
In conclusion, the 10AX090R2F40I1SG chip model is a powerful and efficient solution for digital signal processing, embedded processing, image processing and more. It can be used in a variety of applications and can be upgraded to meet the needs of future technologies. Additionally, it can be used for the development and popularization of future intelligent robots. To use the chip model effectively, it requires a certain level of technical knowledge and expertise. With the right skillset, the chip model can be used to create powerful and efficient solutions.
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2,979 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $26,579.7477 | $26,579.7477 |
| 10+ | $26,293.9440 | $262,939.4399 |
| 100+ | $24,864.9253 | $2,486,492.5293 |
| 1000+ | $23,435.9066 | $11,717,953.2990 |
| 10000+ | $21,435.2804 | $21,435,280.4250 |
| The price is for reference only, please refer to the actual quotation! | ||