Intel Corporation
10AX090R2F40E2SG
10AX090R2F40E2SG ECAD Model
10AX090R2F40E2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 342 | |
| Number of Outputs | 342 | |
| Number of Logic Cells | 900000 | |
| Number of CLBs | 33962 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 33962 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX090R2F40E2SG Datasheet Download
10AX090R2F40E2SG Overview
The chip model 10AX090R2F40E2SG is a powerful and versatile model designed for digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is a powerful and complex language for the development of digital systems. The original design intention of this model was to provide a powerful and versatile solution for digital signal processing and embedded processing applications.
The model is also capable of being upgraded in the future to meet the changing needs of digital signal processing and embedded processing applications. This model is also capable of being applied to advanced communication systems, such as 5G networks. With the increasing demand for high-performance communication systems, this chip model is a great choice for meeting those needs.
The chip model 10AX090R2F40E2SG can also be applied to the development and popularization of future intelligent robots. This model is capable of providing the necessary processing power to enable robots to perform complex tasks. However, due to the complexity of the HDL language, technical talents are needed to effectively use this model. Those with experience in digital signal processing and embedded processing will have the best chance of success in using this model.
In conclusion, the chip model 10AX090R2F40E2SG is a powerful and versatile model designed for digital signal processing, embedded processing, and image processing. It is capable of being upgraded in the future and applied to advanced communication systems and intelligent robots. However, due to the complexity of the HDL language, technical talents are needed to effectively use this model.
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4,854 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,565.2164 | $4,565.2164 |
| 10+ | $4,516.1280 | $45,161.2802 |
| 100+ | $4,270.6863 | $427,068.6276 |
| 1000+ | $4,025.2445 | $2,012,622.2680 |
| 10000+ | $3,681.6261 | $3,681,626.1000 |
| The price is for reference only, please refer to the actual quotation! | ||