
Intel Corporation
10AX090N4F45I3SG
10AX090N4F45I3SG ECAD Model
10AX090N4F45I3SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 768 | |
Number of Outputs | 768 | |
Number of Logic Cells | 900000 | |
Number of CLBs | 33962 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 33962 CLBS | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1932 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1932 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1932,44X44,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 45 mm | |
Length | 45 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1932,44X44,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX090N4F45I3SG Datasheet Download
10AX090N4F45I3SG Overview
The chip model 10AX090N4F45I3SG is a powerful piece of technology that has been developed to meet the ever-changing demands of the modern world. It is a highly advanced model that is designed to provide a wide range of functions and features. Its original design intention was to provide a high-performance, low-power solution for a variety of applications.
The chip model 10AX090N4F45I3SG is capable of handling a wide range of tasks and applications. It is capable of running a variety of operating systems, as well as being able to support a wide range of communication protocols. This makes it an ideal choice for many applications, especially those that require high-speed data transfer.
When it comes to the industry trends of the chip model 10AX090N4F45I3SG and the future development of related industries, it is important to consider the specific technologies that will be needed in order for it to be successful. As technology continues to advance, the need for more powerful chips and more efficient communication protocols will become increasingly important. This means that the chip model 10AX090N4F45I3SG will need to be able to keep up with the latest trends in order to remain competitive.
The chip model 10AX090N4F45I3SG is also capable of being upgraded and improved in order to meet the demands of the future. This means that it is possible for the chip model 10AX090N4F45I3SG to be used in advanced communication systems and networks. This could include being used in intelligent scenarios such as self-driving vehicles, smart homes, and other applications that require complex communication protocols.
The chip model 10AX090N4F45I3SG is also capable of being used in the era of fully intelligent systems. This means that it is possible for the chip model 10AX090N4F45I3SG to be used in a variety of intelligent scenarios. This could include being used in intelligent medical systems, automated factories, and other applications that require complex communication protocols and machine learning algorithms.
Overall, the chip model 10AX090N4F45I3SG is a powerful piece of technology that has been developed to meet the ever-changing demands of the modern world. Its original design intention was to provide a high-performance, low-power solution for a variety of applications. Its ability to be upgraded and improved in order to meet the demands of the future makes it an ideal choice for many applications. Its ability to be used in advanced communication systems and networks, as well as being used in intelligent scenarios, makes it an ideal choice for a variety of applications. Therefore, it is important to consider the specific technologies that will be needed in order for it to remain competitive in the future.
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3,277 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $15,107.6341 | $15,107.6341 |
10+ | $14,945.1865 | $149,451.8647 |
100+ | $14,132.9481 | $1,413,294.8073 |
1000+ | $13,320.7097 | $6,660,354.8390 |
10000+ | $12,183.5759 | $12,183,575.9250 |
The price is for reference only, please refer to the actual quotation! |