Intel Corporation
10AX090N4F45E3LG
10AX090N4F45E3LG ECAD Model
10AX090N4F45E3LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 768 | |
| Number of Outputs | 768 | |
| Number of Logic Cells | 900000 | |
| Number of CLBs | 33962 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 33962 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1932 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1932 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1932,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1932,44X44,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX090N4F45E3LG Datasheet Download
10AX090N4F45E3LG Overview
The chip model 10AX090N4F45E3LG has been designed with a specific purpose in mind, and it has the potential to revolutionize the way we interact with technology. This chip model is designed to be a reliable, low-power, high-performance solution for a variety of applications. It is expected to have a significant impact on the future demand of related industries.
The original design intention of the chip model 10AX090N4F45E3LG is to provide a reliable and powerful solution for a variety of applications. The chip is designed to be low power, high performance, and efficient. It is also designed to be able to handle the demands of a variety of communication systems. This chip is expected to be able to handle the demands of the next generation of communication systems, and it is expected to be able to provide a reliable and efficient solution for a variety of applications.
The chip model 10AX090N4F45E3LG is expected to have a significant impact on the future demand of related industries. It is expected to be able to provide a reliable and efficient solution for a variety of applications, including networks and intelligent scenarios. It is also expected to be able to be used in the era of fully intelligent systems, as it is designed to be able to handle the demands of the next generation of communication systems.
The chip model 10AX090N4F45E3LG is designed to be a reliable and powerful solution for a variety of applications. It is expected to have a significant impact on the future demand of related industries, as it is designed to be able to handle the demands of the next generation of communication systems. It is also expected to be able to provide a reliable and efficient solution for a variety of applications, including networks and intelligent scenarios. It is also expected to be able to be used in the era of fully intelligent systems, as it is designed to be able to handle the demands of the next generation of communication systems. Furthermore, the chip model 10AX090N4F45E3LG is also expected to be able to be upgraded in the future, as it is designed to be able to handle the demands of the next generation of communication systems.
Overall, the chip model 10AX090N4F45E3LG is expected to revolutionize the way we interact with technology. It is designed to be a reliable and powerful solution for a variety of applications. It is expected to have a significant impact on the future demand of related industries, as it is designed to be able to handle the demands of the next generation of communication systems. It is also expected to be able to provide a reliable and efficient solution for a variety of applications, including networks and intelligent scenarios. Furthermore, the chip model 10AX090N4F45E3LG is also expected to be able to be upgraded in the future, as it is designed to be able to handle the demands of the next generation of communication systems. All of this combined makes the chip model 10AX090N4F45E3LG a great solution for a variety of applications, and it is expected to have a significant impact on the future demand of related industries.
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4,108 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,603.9457 | $3,603.9457 |
| 10+ | $3,565.1936 | $35,651.9357 |
| 100+ | $3,371.4330 | $337,143.3048 |
| 1000+ | $3,177.6725 | $1,588,836.2640 |
| 10000+ | $2,906.4078 | $2,906,407.8000 |
| The price is for reference only, please refer to the actual quotation! | ||