Intel Corporation
10AX090N3F45I2SG
10AX090N3F45I2SG ECAD Model
10AX090N3F45I2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 768 | |
| Number of Outputs | 768 | |
| Number of Logic Cells | 900000 | |
| Number of CLBs | 33962 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 33962 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1932 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1932 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1932,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1932,44X44,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX090N3F45I2SG Datasheet Download
10AX090N3F45I2SG Overview
The chip model 10AX090N3F45I2SG is a semiconductor device designed for a variety of applications, including networks, intelligent systems, and robots. As technology advances, the industry trends of the chip model 10AX090N3F45I2SG and the future development of related industries are constantly evolving. It is important to consider what specific technologies are needed for the application environment to ensure that the chip model 10AX090N3F45I2SG is able to meet user needs.
The chip model 10AX090N3F45I2SG is designed to be used in networks and intelligent scenarios. It is possible to use the chip model 10AX090N3F45I2SG in the era of fully intelligent systems. The chip model 10AX090N3F45I2SG can be used to develop and popularize future intelligent robots. To use the model effectively, technical talents are needed to understand the capabilities of the chip model 10AX090N3F45I2SG and how it can be used to create and improve intelligent systems.
The chip model 10AX090N3F45I2SG is an important tool for creating and developing intelligent systems. Its application environment must be carefully considered to ensure that the chip model 10AX090N3F45I2SG is able to meet user needs and provide the best possible performance. Technical talents are needed to understand the capabilities of the chip model 10AX090N3F45I2SG and how it can be used to create and improve intelligent systems. By understanding the current industry trends of the chip model 10AX090N3F45I2SG and the future development of related industries, it is possible to create and develop intelligent systems that are capable of meeting user needs and providing the best possible performance.
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2,078 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $19,389.7924 | $19,389.7924 |
| 10+ | $19,181.3000 | $191,812.9997 |
| 100+ | $18,138.8380 | $1,813,883.8017 |
| 1000+ | $17,096.3761 | $8,548,188.0310 |
| 10000+ | $15,636.9293 | $15,636,929.3250 |
| The price is for reference only, please refer to the actual quotation! | ||