Intel Corporation
10AX090N3F40I2SG
10AX090N3F40I2SG ECAD Model
10AX090N3F40I2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 900000 | |
| Number of CLBs | 33962 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 33962 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX090N3F40I2SG Datasheet Download
10AX090N3F40I2SG Overview
The chip model 10AX090N3F40I2SG is a powerful and versatile processor that is suitable for a wide range of applications. It is designed for high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, making it an ideal choice for a variety of applications.
The industry trends for this chip model are constantly changing, and new technologies are being developed to meet the demands of modern applications. It is possible that the chip model 10AX090N3F40I2SG could be used in networks and intelligent scenarios in the near future. With the rapid development of technology, the chip model could be used in the era of fully intelligent systems, such as autonomous vehicles, robotics, and artificial intelligence.
The chip model 10AX090N3F40I2SG is an excellent choice for a variety of applications, and is capable of meeting the demands of modern applications. It is designed to be powerful and versatile, and is capable of handling a wide range of tasks. Its use of HDL language makes it an ideal choice for applications that require high-performance digital signal processing, embedded processing, and image processing.
The industry trends for the 10AX090N3F40I2SG are constantly changing, and new technologies are being developed to meet the demands of modern applications. It is possible that the chip model could be used in networks and intelligent scenarios in the near future. With the rapid development of technology, the chip model could be used in the era of fully intelligent systems, such as autonomous vehicles, robotics, and artificial intelligence.
The chip model 10AX090N3F40I2SG is an excellent choice for a variety of applications, and is capable of meeting the demands of modern applications. It is designed to be powerful and versatile, and is capable of handling a wide range of tasks. Its use of HDL language makes it an ideal choice for applications that require high-performance digital signal processing, embedded processing, and image processing.
The future of the chip model 10AX090N3F40I2SG is one of continued development and advancement. As technology continues to develop, the chip model will be adapted to meet the demands of modern applications. It is possible that the chip model could be used in networks and intelligent scenarios in the near future, and will be an integral part of the era of fully intelligent systems.
In conclusion, the chip model 10AX090N3F40I2SG is an excellent choice for a variety of applications. It is powerful and versatile, and is capable of handling a wide range of tasks. It is designed for high-performance digital signal processing, embedded processing, and image processing. As technology continues to develop, the chip model will be adapted to meet the demands of modern applications, and will be an integral part of the era of fully intelligent systems.
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4,330 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,304.7937 | $4,304.7937 |
| 10+ | $4,258.5056 | $42,585.0557 |
| 100+ | $4,027.0650 | $402,706.5048 |
| 1000+ | $3,795.6245 | $1,897,812.2640 |
| 10000+ | $3,471.6078 | $3,471,607.8000 |
| The price is for reference only, please refer to the actual quotation! | ||