Intel Corporation
10AX090N3F40I2LG
10AX090N3F40I2LG ECAD Model
10AX090N3F40I2LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 900000 | |
| Number of CLBs | 33962 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 33962 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX090N3F40I2LG Datasheet Download
10AX090N3F40I2LG Overview
The chip model 10AX090N3F40I2LG is a powerful and advanced integrated circuit that is suitable for a variety of applications. It is designed to provide high-performance digital signal processing, embedded processing, image processing and other operations. The chip model is capable of performing a variety of calculations and operations quickly and efficiently, making it an ideal choice for applications that require high-performance computing power.
The original design intention of the chip model 10AX090N3F40I2LG was to provide a platform for advanced digital signal processing, embedded processing, and image processing. The chip model is capable of performing a variety of operations quickly and efficiently, making it an ideal choice for applications that require high-performance computing power. Furthermore, the chip model is designed to be highly customizable, allowing for future upgrades and expansions. This makes it a great choice for applications that require advanced communication systems.
The chip model 10AX090N3F40I2LG has the potential to be applied to the development and popularization of future intelligent robots. By leveraging the chip model’s powerful computing capabilities, it is possible to create robots with sophisticated and advanced capabilities. In order to use the chip model effectively, it is necessary to have a deep understanding of the HDL language. Those with technical talents in this area will be able to use the chip model to its fullest potential and create powerful and advanced robots.
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5,419 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $23,499.6924 | $23,499.6924 |
| 10+ | $23,247.0075 | $232,470.0749 |
| 100+ | $21,983.5832 | $2,198,358.3168 |
| 1000+ | $20,720.1588 | $10,360,079.4240 |
| 10000+ | $18,951.3648 | $18,951,364.8000 |
| The price is for reference only, please refer to the actual quotation! | ||