10AX090N3F40E2LG
10AX090N3F40E2LG
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rohs

Intel Corporation

10AX090N3F40E2LG


10AX090N3F40E2LG
F18-10AX090N3F40E2LG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1517,39X39,40
BGA, BGA1517,39X39,40

10AX090N3F40E2LG ECAD Model


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10AX090N3F40E2LG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 600
Number of Outputs 600
Number of Logic Cells 900000
Number of CLBs 33962
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology TSMC
Organization 33962 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1517
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1517,39X39,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1517,39X39,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AX090N3F40E2LG Datasheet Download


10AX090N3F40E2LG Overview



The chip model 10AX090N3F40E2LG is an integrated circuit that is well-suited for high-performance digital signal processing, embedded processing, and image processing. This chip requires the use of HDL language for programming. It is a highly versatile chip that can be used in a variety of applications and scenarios.


The 10AX090N3F40E2LG can be deployed in networks for various intelligent scenarios. It is capable of handling complex data processing tasks and can be used to power various intelligent systems. It can be used in the era of fully intelligent systems as well, as it has the capability to process large amounts of data quickly and efficiently.


The product description of the 10AX090N3F40E2LG includes a wide range of features and specifications. It has a low-power design, which makes it suitable for battery-powered applications. It has a high-speed interface and supports a wide range of communication protocols. The chip also has a multi-threaded architecture which allows it to handle multiple tasks simultaneously.


When designing with the 10AX090N3F40E2LG, it is important to consider the specific design requirements. This includes the selection of the right components, the right programming language, and the right design methodology. It is also important to consider the power consumption and the potential heat dissipation of the chip.


In addition to the product description, there are also several case studies and precautions that should be taken into consideration when using the 10AX090N3F40E2LG. One case study involves using the chip for a robotic arm. The chip was used to control the robotic arm and was able to process the data quickly and accurately. The precautions that should be taken include ensuring that the chip is properly cooled and that the power consumption is kept to a minimum.


Overall, the 10AX090N3F40E2LG is a highly versatile chip that can be used for a variety of applications and scenarios. It is capable of handling complex data processing tasks and can be used to power various intelligent systems. It is important to consider the product description, design requirements, case studies, and precautions when using the chip.



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Unit Price: $4,959.2133
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Pricing (USD)

QTY Unit Price Ext Price
1+ $4,612.0684 $4,612.0684
10+ $4,562.4762 $45,624.7624
100+ $4,314.5156 $431,451.5571
1000+ $4,066.5549 $2,033,277.4530
10000+ $3,719.4100 $3,719,409.9750
The price is for reference only, please refer to the actual quotation!

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