
Intel Corporation
10AX090N3F40E2LG
10AX090N3F40E2LG ECAD Model
10AX090N3F40E2LG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 600 | |
Number of Outputs | 600 | |
Number of Logic Cells | 900000 | |
Number of CLBs | 33962 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 33962 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1517 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1517,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1517,39X39,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX090N3F40E2LG Datasheet Download
10AX090N3F40E2LG Overview
The chip model 10AX090N3F40E2LG is an integrated circuit that is well-suited for high-performance digital signal processing, embedded processing, and image processing. This chip requires the use of HDL language for programming. It is a highly versatile chip that can be used in a variety of applications and scenarios.
The 10AX090N3F40E2LG can be deployed in networks for various intelligent scenarios. It is capable of handling complex data processing tasks and can be used to power various intelligent systems. It can be used in the era of fully intelligent systems as well, as it has the capability to process large amounts of data quickly and efficiently.
The product description of the 10AX090N3F40E2LG includes a wide range of features and specifications. It has a low-power design, which makes it suitable for battery-powered applications. It has a high-speed interface and supports a wide range of communication protocols. The chip also has a multi-threaded architecture which allows it to handle multiple tasks simultaneously.
When designing with the 10AX090N3F40E2LG, it is important to consider the specific design requirements. This includes the selection of the right components, the right programming language, and the right design methodology. It is also important to consider the power consumption and the potential heat dissipation of the chip.
In addition to the product description, there are also several case studies and precautions that should be taken into consideration when using the 10AX090N3F40E2LG. One case study involves using the chip for a robotic arm. The chip was used to control the robotic arm and was able to process the data quickly and accurately. The precautions that should be taken include ensuring that the chip is properly cooled and that the power consumption is kept to a minimum.
Overall, the 10AX090N3F40E2LG is a highly versatile chip that can be used for a variety of applications and scenarios. It is capable of handling complex data processing tasks and can be used to power various intelligent systems. It is important to consider the product description, design requirements, case studies, and precautions when using the chip.
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2,793 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $4,612.0684 | $4,612.0684 |
10+ | $4,562.4762 | $45,624.7624 |
100+ | $4,314.5156 | $431,451.5571 |
1000+ | $4,066.5549 | $2,033,277.4530 |
10000+ | $3,719.4100 | $3,719,409.9750 |
The price is for reference only, please refer to the actual quotation! |