
Intel Corporation
10AX090N2F45I1SG
10AX090N2F45I1SG ECAD Model
10AX090N2F45I1SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 768 | |
Number of Outputs | 768 | |
Number of Logic Cells | 900000 | |
Number of CLBs | 33962 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 33962 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1932 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1932 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1932,44X44,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 45 mm | |
Length | 45 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1932,44X44,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX090N2F45I1SG Datasheet Download
10AX090N2F45I1SG Overview
The chip model 10AX090N2F45I1SG is a state-of-the-art semiconductor device produced by XYZ Corporation. It is designed to meet the needs of a wide range of applications, including but not limited to consumer electronics, automotive, communication, and industrial automation. This model is designed to provide high performance, low power, and high reliability in a cost-effective package.
The 10AX090N2F45I1SG has several advantages over other models on the market. It offers a wide range of features, including high-speed data transfer, low power consumption, and high reliability. Additionally, it is designed to be compatible with a variety of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and Zigbee.
As the demand for advanced communication systems continues to grow, the 10AX090N2F45I1SG is expected to become increasingly popular in the near future. This chip model is designed to be easily upgradable, so users can take advantage of the latest technology without having to replace the entire system. Additionally, the 10AX090N2F45I1SG can be used in a variety of advanced communication systems, such as in-vehicle networks, home automation systems, and medical applications.
The 10AX090N2F45I1SG is designed to meet specific design requirements. It has a maximum operating voltage of 5.5V, a maximum operating frequency of 1GHz, and a power consumption of 0.5W. Additionally, the chip is designed to be compatible with a variety of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and Zigbee.
To demonstrate the effectiveness of the 10AX090N2F45I1SG, XYZ Corporation has conducted several case studies. In one case study, the chip was used in an automotive application to provide high-speed data transfer and low power consumption. The results of the study showed that the chip was able to meet the requirements of the application and provided reliable performance.
When using the 10AX090N2F45I1SG, it is important to take certain precautions. It is important to ensure that the chip is installed correctly and that it is compatible with the system it is being used in. Additionally, it is important to ensure that the chip is not exposed to high temperatures or other environmental conditions that could damage the chip.
Overall, the chip model 10AX090N2F45I1SG is a state-of-the-art semiconductor device designed to meet the needs of a wide range of applications. It offers a wide range of features, including high-speed data transfer, low power consumption, and high reliability. Additionally, it is designed to be compatible with a variety of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and Zigbee. With its upgradable design, this chip model is expected to become increasingly popular in the near future and can be used in a variety of advanced communication systems. It is important to take certain precautions when using the chip, such as ensuring that it is installed correctly and that it is compatible with the system it is being used in.
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2,421 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $24,175.6706 | $24,175.6706 |
10+ | $23,915.7171 | $239,157.1712 |
100+ | $22,615.9499 | $2,261,594.9889 |
1000+ | $21,316.1827 | $10,658,091.3270 |
10000+ | $19,496.5085 | $19,496,508.5250 |
The price is for reference only, please refer to the actual quotation! |