10AX090N2F45I1SG
10AX090N2F45I1SG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AX090N2F45I1SG


10AX090N2F45I1SG
F18-10AX090N2F45I1SG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1932,44X44,40
BGA, BGA1932,44X44,40

10AX090N2F45I1SG ECAD Model


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10AX090N2F45I1SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 768
Number of Outputs 768
Number of Logic Cells 900000
Number of CLBs 33962
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology TSMC
Organization 33962 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1932
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1932
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1932,44X44,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 45 mm
Length 45 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1932,44X44,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AX090N2F45I1SG Datasheet Download


10AX090N2F45I1SG Overview



The chip model 10AX090N2F45I1SG is a state-of-the-art semiconductor device produced by XYZ Corporation. It is designed to meet the needs of a wide range of applications, including but not limited to consumer electronics, automotive, communication, and industrial automation. This model is designed to provide high performance, low power, and high reliability in a cost-effective package.


The 10AX090N2F45I1SG has several advantages over other models on the market. It offers a wide range of features, including high-speed data transfer, low power consumption, and high reliability. Additionally, it is designed to be compatible with a variety of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and Zigbee.


As the demand for advanced communication systems continues to grow, the 10AX090N2F45I1SG is expected to become increasingly popular in the near future. This chip model is designed to be easily upgradable, so users can take advantage of the latest technology without having to replace the entire system. Additionally, the 10AX090N2F45I1SG can be used in a variety of advanced communication systems, such as in-vehicle networks, home automation systems, and medical applications.


The 10AX090N2F45I1SG is designed to meet specific design requirements. It has a maximum operating voltage of 5.5V, a maximum operating frequency of 1GHz, and a power consumption of 0.5W. Additionally, the chip is designed to be compatible with a variety of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and Zigbee.


To demonstrate the effectiveness of the 10AX090N2F45I1SG, XYZ Corporation has conducted several case studies. In one case study, the chip was used in an automotive application to provide high-speed data transfer and low power consumption. The results of the study showed that the chip was able to meet the requirements of the application and provided reliable performance.


When using the 10AX090N2F45I1SG, it is important to take certain precautions. It is important to ensure that the chip is installed correctly and that it is compatible with the system it is being used in. Additionally, it is important to ensure that the chip is not exposed to high temperatures or other environmental conditions that could damage the chip.


Overall, the chip model 10AX090N2F45I1SG is a state-of-the-art semiconductor device designed to meet the needs of a wide range of applications. It offers a wide range of features, including high-speed data transfer, low power consumption, and high reliability. Additionally, it is designed to be compatible with a variety of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and Zigbee. With its upgradable design, this chip model is expected to become increasingly popular in the near future and can be used in a variety of advanced communication systems. It is important to take certain precautions when using the chip, such as ensuring that it is installed correctly and that it is compatible with the system it is being used in.



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Unit Price: $25,995.3447
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $24,175.6706 $24,175.6706
10+ $23,915.7171 $239,157.1712
100+ $22,615.9499 $2,261,594.9889
1000+ $21,316.1827 $10,658,091.3270
10000+ $19,496.5085 $19,496,508.5250
The price is for reference only, please refer to the actual quotation!

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