Intel Corporation
10AX090N2F40E1SG
10AX090N2F40E1SG ECAD Model
10AX090N2F40E1SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 900000 | |
| Number of CLBs | 33962 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 33962 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX090N2F40E1SG Datasheet Download
10AX090N2F40E1SG Overview
The chip model 10AX090N2F40E1SG is a powerful and versatile semiconductor component designed to be used in a wide range of applications. It is an integrated circuit (IC) that combines multiple components, such as transistors, resistors, and capacitors, into a single package. This allows for a more efficient use of space and power, making it ideal for a variety of applications.
The original design intention of the chip model 10AX090N2F40E1SG was to provide an efficient, cost-effective solution for a wide range of applications. It is designed to be used in a variety of systems, such as communication systems, control systems, and industrial automation systems. It is also capable of being used in advanced communication systems, such as 5G networks.
The product description and specific design requirements of the chip model 10AX090N2F40E1SG are quite extensive. It is designed to be used in a wide range of applications, including communication systems, control systems, and industrial automation systems. It is also capable of being used in advanced communication systems, such as 5G networks. The chip has a wide range of features, including low power consumption, high speed, and high reliability. It also has a wide range of operating temperatures, from -40°C to +85°C.
In addition, the chip model 10AX090N2F40E1SG has the potential to be upgraded in the future. It is designed to be compatible with a wide range of systems, and it can be adapted to new technologies as they become available. This allows it to remain relevant and useful in the long term.
The chip model 10AX090N2F40E1SG can also be applied to the development and popularization of future intelligent robots. It is designed to be used in a wide range of systems, and it is capable of being used in advanced communication systems, such as 5G networks. In order to use the chip model effectively, it is important to have a good understanding of the underlying technologies, as well as the specific design requirements. It is also important to have a good understanding of the specific application in which the chip will be used.
In conclusion, the chip model 10AX090N2F40E1SG is a powerful and versatile semiconductor component that can be used in a wide range of applications. It is designed to be used in a variety of systems, and it has the potential to be upgraded in the future. It can also be applied to the development and popularization of future intelligent robots, but it is important to have a good understanding of the underlying technologies and the specific design requirements in order to use the chip model effectively.
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4,190 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $20,507.4981 | $20,507.4981 |
| 10+ | $20,286.9873 | $202,869.8734 |
| 100+ | $19,184.4337 | $1,918,443.3684 |
| 1000+ | $18,081.8800 | $9,040,940.0120 |
| 10000+ | $16,538.3049 | $16,538,304.9000 |
| The price is for reference only, please refer to the actual quotation! | ||