
Intel Corporation
10AX090N1F45E1SG
10AX090N1F45E1SG ECAD Model
10AX090N1F45E1SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 768 | |
Number of Outputs | 768 | |
Number of Logic Cells | 900000 | |
Number of CLBs | 33962 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 33962 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1932 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1932 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1932,44X44,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 45 mm | |
Length | 45 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1932,44X44,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX090N1F45E1SG Datasheet Download
10AX090N1F45E1SG Overview
The chip model 10AX090N1F45E1SG is a product of the semiconductor manufacturer Xilinx, designed to provide a wide range of advanced communication systems. Its original design intention is to provide users with a powerful, low-cost, low-power solution for applications ranging from wireless communications to high-speed data processing.
The 10AX090N1F45E1SG features a wide range of features, including high-speed transceivers, high-speed memory interfaces, and a wide range of digital signal processing (DSP) capabilities. It also has a low-power, low-cost design that is suitable for a wide range of applications. The chip model is designed to be highly reliable, with a long life cycle and low power consumption.
The 10AX090N1F45E1SG can be used in a variety of advanced communication systems, including wireless networks, satellite communications, and digital television systems. It can also be used in a variety of industrial applications, such as automation and robotics. The chip model can also be used in the development and popularization of future intelligent robots, as it offers a wide range of features that can be used to control and monitor robotic systems.
The 10AX090N1F45E1SG is highly customizable and can be easily upgraded to meet the needs of future applications. It is also capable of supporting a wide range of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and Zigbee. The chip model is also capable of supporting a wide range of operating systems, including Linux, Windows, and Android.
In order to use the 10AX090N1F45E1SG effectively, it is important to understand the product description and specific design requirements. It is also important to understand the actual case studies and precautions that are associated with the chip model. This will help ensure that the chip model is used in an appropriate manner and that it is properly utilized in an application.
In addition, it is important to understand the technical talents that are needed to use the chip model effectively. This includes having experience in digital signal processing, data transmission, and communication protocols. It also requires an understanding of the software and hardware components that are necessary to use the chip model in an application.
Overall, the chip model 10AX090N1F45E1SG is a powerful, low-cost, low-power solution for a wide range of advanced communication systems. It is highly customizable, allowing for future upgrades and applications. It is also capable of supporting a wide range of communication protocols and operating systems. In order to use the chip model effectively, it is important to understand the product description and specific design requirements, as well as the actual case studies and precautions associated with the chip model. Furthermore, it is important to understand the technical talents that are necessary to use the chip model effectively.
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2,713 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $24,677.5778 | $24,677.5778 |
10+ | $24,412.2275 | $244,122.2751 |
100+ | $23,085.4760 | $2,308,547.6013 |
1000+ | $21,758.7245 | $10,879,362.2590 |
10000+ | $19,901.2724 | $19,901,272.4250 |
The price is for reference only, please refer to the actual quotation! |