10AX090N1F45E1SG
10AX090N1F45E1SG
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rohs

Intel Corporation

10AX090N1F45E1SG


10AX090N1F45E1SG
F18-10AX090N1F45E1SG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1932,44X44,40
BGA, BGA1932,44X44,40

10AX090N1F45E1SG ECAD Model


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10AX090N1F45E1SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 768
Number of Outputs 768
Number of Logic Cells 900000
Number of CLBs 33962
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology TSMC
Organization 33962 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1932
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1932
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1932,44X44,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 45 mm
Length 45 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1932,44X44,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AX090N1F45E1SG Datasheet Download


10AX090N1F45E1SG Overview



The chip model 10AX090N1F45E1SG is a product of the semiconductor manufacturer Xilinx, designed to provide a wide range of advanced communication systems. Its original design intention is to provide users with a powerful, low-cost, low-power solution for applications ranging from wireless communications to high-speed data processing.


The 10AX090N1F45E1SG features a wide range of features, including high-speed transceivers, high-speed memory interfaces, and a wide range of digital signal processing (DSP) capabilities. It also has a low-power, low-cost design that is suitable for a wide range of applications. The chip model is designed to be highly reliable, with a long life cycle and low power consumption.


The 10AX090N1F45E1SG can be used in a variety of advanced communication systems, including wireless networks, satellite communications, and digital television systems. It can also be used in a variety of industrial applications, such as automation and robotics. The chip model can also be used in the development and popularization of future intelligent robots, as it offers a wide range of features that can be used to control and monitor robotic systems.


The 10AX090N1F45E1SG is highly customizable and can be easily upgraded to meet the needs of future applications. It is also capable of supporting a wide range of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and Zigbee. The chip model is also capable of supporting a wide range of operating systems, including Linux, Windows, and Android.


In order to use the 10AX090N1F45E1SG effectively, it is important to understand the product description and specific design requirements. It is also important to understand the actual case studies and precautions that are associated with the chip model. This will help ensure that the chip model is used in an appropriate manner and that it is properly utilized in an application.


In addition, it is important to understand the technical talents that are needed to use the chip model effectively. This includes having experience in digital signal processing, data transmission, and communication protocols. It also requires an understanding of the software and hardware components that are necessary to use the chip model in an application.


Overall, the chip model 10AX090N1F45E1SG is a powerful, low-cost, low-power solution for a wide range of advanced communication systems. It is highly customizable, allowing for future upgrades and applications. It is also capable of supporting a wide range of communication protocols and operating systems. In order to use the chip model effectively, it is important to understand the product description and specific design requirements, as well as the actual case studies and precautions associated with the chip model. Furthermore, it is important to understand the technical talents that are necessary to use the chip model effectively.



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Unit Price: $26,535.0299
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $24,677.5778 $24,677.5778
10+ $24,412.2275 $244,122.2751
100+ $23,085.4760 $2,308,547.6013
1000+ $21,758.7245 $10,879,362.2590
10000+ $19,901.2724 $19,901,272.4250
The price is for reference only, please refer to the actual quotation!

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