Intel Corporation
10AX090N1F40E1SG
10AX090N1F40E1SG ECAD Model
10AX090N1F40E1SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 900000 | |
| Number of CLBs | 33962 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 33962 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX090N1F40E1SG Datasheet Download
10AX090N1F40E1SG Overview
The chip model 10AX090N1F40E1SG has become increasingly popular in the tech industry in recent years. This chip model is a type of integrated circuit (IC) that contains millions of transistors and other electronic components. It has been used in a variety of applications, such as in network communication, autonomous vehicles, and artificial intelligence (AI).
In terms of industry trends, the chip model 10AX090N1F40E1SG has been used in a variety of applications, from consumer electronics to industrial automation. It is predicted that the chip model will continue to be used in more applications as technology advances. In addition, it is expected that the chip model will be used in more intelligent scenarios and networks in the future.
When it comes to product description and design requirements, the chip model 10AX090N1F40E1SG is designed to be used in a wide range of applications. It is designed with a low power consumption and a high degree of reliability. It has a wide range of operating temperatures and is capable of handling high-speed data transmission. It also has a wide range of voltage levels and can be used in a variety of environments.
In terms of actual case studies and precautions, the chip model 10AX090N1F40E1SG has been used successfully in a variety of applications. For example, it has been used in autonomous vehicles for navigation, in network communications for data transmission, and in AI for facial recognition. However, it is important to note that the chip model must be used in accordance with the manufacturer's instructions in order to ensure proper operation.
In conclusion, the chip model 10AX090N1F40E1SG is a versatile and reliable IC that has been used in a variety of applications. Its future use will depend on the specific technologies that are needed in the application environment. It is expected to be used in more intelligent scenarios and networks in the future. It is important to note that the chip model must be used in accordance with the manufacturer's instructions in order to ensure proper operation.
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5,181 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $23,925.3705 | $23,925.3705 |
| 10+ | $23,668.1084 | $236,681.0842 |
| 100+ | $22,381.7982 | $2,238,179.8176 |
| 1000+ | $21,095.4879 | $10,547,743.9680 |
| 10000+ | $19,294.6536 | $19,294,653.6000 |
| The price is for reference only, please refer to the actual quotation! | ||