
Intel Corporation
10AX090H4F34I3LG
10AX090H4F34I3LG ECAD Model
10AX090H4F34I3LG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 504 | |
Number of Outputs | 504 | |
Number of Logic Cells | 900000 | |
Number of CLBs | 33962 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 33962 CLBS | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1152,34X34,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX090H4F34I3LG Datasheet Download
10AX090H4F34I3LG Overview
The chip model 10AX090H4F34I3LG is a powerful semiconductor device designed for high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, which is a hardware description language used for design, simulation, and synthesis of digital designs. This chip model is suitable for a wide range of applications, including but not limited to industrial automation, medical imaging, and consumer electronics.
The future of the chip model 10AX090H4F34I3LG and the related industry is dependent on the specific technologies needed for the application environment. As technology advances, the capabilities of the chip model will be expanded and new applications can be explored. For example, the chip model can be used in networks and intelligent scenarios, such as machine learning and artificial intelligence. This chip model will be essential in the era of fully intelligent systems, as it can process large amounts of data quickly and efficiently.
In conclusion, the chip model 10AX090H4F34I3LG is suitable for a wide range of applications and is capable of providing high-performance digital signal processing, embedded processing, and image processing. It is also capable of being used in networks and intelligent scenarios, and will be essential in the era of fully intelligent systems. As technology advances, the capabilities of the chip model will be expanded, allowing for more applications and possibilities.
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4,868 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $15,036.2145 | $15,036.2145 |
10+ | $14,874.5348 | $148,745.3479 |
100+ | $14,066.1362 | $1,406,613.6162 |
1000+ | $13,257.7375 | $6,628,868.7660 |
10000+ | $12,125.9795 | $12,125,979.4500 |
The price is for reference only, please refer to the actual quotation! |