
Intel Corporation
10AX090H3F34E2SG
10AX090H3F34E2SG ECAD Model
10AX090H3F34E2SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 504 | |
Number of Outputs | 504 | |
Number of Logic Cells | 900000 | |
Number of CLBs | 33962 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 33962 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1152,34X34,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX090H3F34E2SG Datasheet Download
10AX090H3F34E2SG Overview
The chip model 10AX090H3F34E2SG is designed to provide high-performance digital signal processing, embedded processing, and image processing capabilities. It requires the use of HDL language, which has become the industry standard for embedded systems. With its advanced features, such as high-speed, low-power consumption, and low-cost, it is suitable for a variety of applications, from consumer electronics to medical devices.
The original design intention of the chip model 10AX090H3F34E2SG was to provide a reliable, high-performance platform for the development of advanced communication systems. It is capable of supporting a range of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and Zigbee. This makes it suitable for a wide range of applications, from home automation to industrial automation.
In addition to its current applications, the chip model 10AX090H3F34E2SG is also capable of being upgraded for future applications. With its advanced features, it is possible to use it in the era of fully intelligent systems. It can be used in networks to provide intelligent control over a wide range of scenarios, from smart homes to smart cities. Its advanced features make it suitable for the development of intelligent systems that can be used in a variety of applications, from autonomous vehicles to smart manufacturing.
Overall, the chip model 10AX090H3F34E2SG is an ideal choice for a wide range of applications. It is capable of providing high-performance digital signal processing, embedded processing, and image processing capabilities. It is also capable of being upgraded for future applications, making it suitable for the development of intelligent systems. With its advanced features, it can be used in networks to provide intelligent control over a wide range of scenarios, from smart homes to smart cities.
You May Also Be Interested In
2,725 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $13,224.3644 | $13,224.3644 |
10+ | $13,082.1670 | $130,821.6696 |
100+ | $12,371.1796 | $1,237,117.9629 |
1000+ | $11,660.1923 | $5,830,096.1470 |
10000+ | $10,664.8100 | $10,664,810.0250 |
The price is for reference only, please refer to the actual quotation! |