10AX090H3F34E2SG
10AX090H3F34E2SG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AX090H3F34E2SG


10AX090H3F34E2SG
F18-10AX090H3F34E2SG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1152,34X34,40
BGA, BGA1152,34X34,40

10AX090H3F34E2SG ECAD Model


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10AX090H3F34E2SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 504
Number of Outputs 504
Number of Logic Cells 900000
Number of CLBs 33962
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology TSMC
Organization 33962 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1152,34X34,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AX090H3F34E2SG Datasheet Download


10AX090H3F34E2SG Overview



The chip model 10AX090H3F34E2SG is designed to provide high-performance digital signal processing, embedded processing, and image processing capabilities. It requires the use of HDL language, which has become the industry standard for embedded systems. With its advanced features, such as high-speed, low-power consumption, and low-cost, it is suitable for a variety of applications, from consumer electronics to medical devices.


The original design intention of the chip model 10AX090H3F34E2SG was to provide a reliable, high-performance platform for the development of advanced communication systems. It is capable of supporting a range of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and Zigbee. This makes it suitable for a wide range of applications, from home automation to industrial automation.


In addition to its current applications, the chip model 10AX090H3F34E2SG is also capable of being upgraded for future applications. With its advanced features, it is possible to use it in the era of fully intelligent systems. It can be used in networks to provide intelligent control over a wide range of scenarios, from smart homes to smart cities. Its advanced features make it suitable for the development of intelligent systems that can be used in a variety of applications, from autonomous vehicles to smart manufacturing.


Overall, the chip model 10AX090H3F34E2SG is an ideal choice for a wide range of applications. It is capable of providing high-performance digital signal processing, embedded processing, and image processing capabilities. It is also capable of being upgraded for future applications, making it suitable for the development of intelligent systems. With its advanced features, it can be used in networks to provide intelligent control over a wide range of scenarios, from smart homes to smart cities.



2,725 In Stock


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Unit Price: $14,219.7467
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $13,224.3644 $13,224.3644
10+ $13,082.1670 $130,821.6696
100+ $12,371.1796 $1,237,117.9629
1000+ $11,660.1923 $5,830,096.1470
10000+ $10,664.8100 $10,664,810.0250
The price is for reference only, please refer to the actual quotation!

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