Intel Corporation
10AX090H2F34E1SG
10AX090H2F34E1SG ECAD Model
10AX090H2F34E1SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 504 | |
| Number of Outputs | 504 | |
| Number of Logic Cells | 900000 | |
| Number of CLBs | 33962 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 33962 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX090H2F34E1SG Datasheet Download
10AX090H2F34E1SG Overview
The chip model 10AX090H2F34E1SG is a powerful processor designed for high-performance digital signal processing, embedded processing, and image processing. Its design intention is to provide a powerful, versatile and reliable platform for a wide range of applications, from simple tasks to complex operations. It is designed to be used with the HDL language, allowing for a high degree of customization and scalability.
The 10AX090H2F34E1SG chip model is capable of handling advanced communication systems. It can be used to create networks that are highly efficient and reliable, allowing for faster and more secure data transmission. It is also suitable for a variety of intelligent scenarios, such as machine learning and artificial intelligence. It can be used to create fully intelligent systems, where machines can learn and adapt to their environment. This chip model is also capable of being upgraded in the future, allowing for more efficient and powerful solutions.
The 10AX090H2F34E1SG chip model is a powerful and versatile processor that is suitable for a wide range of applications. It is designed to be used with the HDL language, allowing for a high degree of customization and scalability. It is capable of handling advanced communication systems, allowing for faster and more secure data transmission. It is also suitable for a variety of intelligent scenarios, such as machine learning and artificial intelligence, and can be used to create fully intelligent systems. It is also capable of being upgraded in the future, allowing for more efficient and powerful solutions.
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1,092 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $16,839.3653 | $16,839.3653 |
| 10+ | $16,658.2968 | $166,582.9685 |
| 100+ | $15,752.9546 | $1,575,295.4628 |
| 1000+ | $14,847.6124 | $7,423,806.2040 |
| 10000+ | $13,580.1333 | $13,580,133.3000 |
| The price is for reference only, please refer to the actual quotation! | ||