
Intel Corporation
10AX066N3F40E2SG
10AX066N3F40E2SG ECAD Model
10AX066N3F40E2SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 588 | |
Number of Outputs | 588 | |
Number of Logic Cells | 660000 | |
Number of CLBs | 25168 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 25168 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1517 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1517,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1517,39X39,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX066N3F40E2SG Datasheet Download
10AX066N3F40E2SG Overview
The 10AX066N3F40E2SG chip model is a highly advanced integrated circuit (IC) designed for use in high-performance digital signal processing, embedded processing, image processing, and other related applications. It is a single-chip solution that requires the use of HDL (Hardware Description Language) for programming, and offers several advantages over traditional ICs.
The 10AX066N3F40E2SG chip model is designed to reduce power consumption and improve performance in a wide range of applications. It offers a higher level of integration, allowing multiple processes to be run simultaneously while still maintaining the same level of performance. This chip model is also highly scalable, allowing it to be used in a variety of applications and systems.
The 10AX066N3F40E2SG chip model is designed with a number of features that make it ideal for use in high-performance digital signal processing, embedded processing, image processing, and other related applications. It has a low-power architecture and can be programmed using HDL. Its high-speed operation and low-power consumption make it an ideal choice for high-performance applications.
In terms of product design, the 10AX066N3F40E2SG chip model has several features that make it an attractive choice for a wide range of applications. It has a wide range of I/O capabilities, allowing for easy integration into existing systems. It also has a high-speed clock frequency and a wide range of memory options. The chip model also provides a number of protection features to ensure reliable operation.
The 10AX066N3F40E2SG chip model is expected to become increasingly popular in the coming years, as demand for high-performance digital signal processing, embedded processing, image processing, and other related applications continues to grow. The chip model's low-power architecture and high-speed operation make it an ideal choice for a wide range of applications.
In terms of actual case studies, the 10AX066N3F40E2SG chip model has been used successfully in a number of applications. It has been used in a variety of applications, including automotive, industrial, and medical applications. In each of these cases, the chip model has provided reliable performance and low power consumption.
When using the 10AX066N3F40E2SG chip model, it is important to consider the specific design requirements of the application. It is also important to consider the power requirements, as the chip model requires a certain amount of power to operate. Additionally, it is important to consider the environment in which the chip model will be used, as some environments may require additional protection features.
Overall, the 10AX066N3F40E2SG chip model is an ideal choice for a wide range of applications, offering high-performance operation, low-power consumption, and a wide range of features. As demand for high-performance digital signal processing, embedded processing, image processing, and other related applications continues to grow, the 10AX066N3F40E2SG chip model is expected to become increasingly popular in the coming years.
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4,145 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $11,852.2005 | $11,852.2005 |
10+ | $11,724.7575 | $117,247.5747 |
100+ | $11,087.5424 | $1,108,754.2392 |
1000+ | $10,450.3273 | $5,225,163.6560 |
10000+ | $9,558.2262 | $9,558,226.2000 |
The price is for reference only, please refer to the actual quotation! |