10AX066N3F40E2SG
10AX066N3F40E2SG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AX066N3F40E2SG


10AX066N3F40E2SG
F18-10AX066N3F40E2SG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1517,39X39,40
BGA, BGA1517,39X39,40

10AX066N3F40E2SG ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

10AX066N3F40E2SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 588
Number of Outputs 588
Number of Logic Cells 660000
Number of CLBs 25168
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology TSMC
Organization 25168 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1517
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1517,39X39,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1517,39X39,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AX066N3F40E2SG Datasheet Download


10AX066N3F40E2SG Overview



The 10AX066N3F40E2SG chip model is a highly advanced integrated circuit (IC) designed for use in high-performance digital signal processing, embedded processing, image processing, and other related applications. It is a single-chip solution that requires the use of HDL (Hardware Description Language) for programming, and offers several advantages over traditional ICs.


The 10AX066N3F40E2SG chip model is designed to reduce power consumption and improve performance in a wide range of applications. It offers a higher level of integration, allowing multiple processes to be run simultaneously while still maintaining the same level of performance. This chip model is also highly scalable, allowing it to be used in a variety of applications and systems.


The 10AX066N3F40E2SG chip model is designed with a number of features that make it ideal for use in high-performance digital signal processing, embedded processing, image processing, and other related applications. It has a low-power architecture and can be programmed using HDL. Its high-speed operation and low-power consumption make it an ideal choice for high-performance applications.


In terms of product design, the 10AX066N3F40E2SG chip model has several features that make it an attractive choice for a wide range of applications. It has a wide range of I/O capabilities, allowing for easy integration into existing systems. It also has a high-speed clock frequency and a wide range of memory options. The chip model also provides a number of protection features to ensure reliable operation.


The 10AX066N3F40E2SG chip model is expected to become increasingly popular in the coming years, as demand for high-performance digital signal processing, embedded processing, image processing, and other related applications continues to grow. The chip model's low-power architecture and high-speed operation make it an ideal choice for a wide range of applications.


In terms of actual case studies, the 10AX066N3F40E2SG chip model has been used successfully in a number of applications. It has been used in a variety of applications, including automotive, industrial, and medical applications. In each of these cases, the chip model has provided reliable performance and low power consumption.


When using the 10AX066N3F40E2SG chip model, it is important to consider the specific design requirements of the application. It is also important to consider the power requirements, as the chip model requires a certain amount of power to operate. Additionally, it is important to consider the environment in which the chip model will be used, as some environments may require additional protection features.


Overall, the 10AX066N3F40E2SG chip model is an ideal choice for a wide range of applications, offering high-performance operation, low-power consumption, and a wide range of features. As demand for high-performance digital signal processing, embedded processing, image processing, and other related applications continues to grow, the 10AX066N3F40E2SG chip model is expected to become increasingly popular in the coming years.



4,145 In Stock


I want to buy

Unit Price: $12,744.3016
The price is for reference only.
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
1+ $11,852.2005 $11,852.2005
10+ $11,724.7575 $117,247.5747
100+ $11,087.5424 $1,108,754.2392
1000+ $10,450.3273 $5,225,163.6560
10000+ $9,558.2262 $9,558,226.2000
The price is for reference only, please refer to the actual quotation!

Quick Quote