
Intel Corporation
10AX066N2F40E2LG
10AX066N2F40E2LG ECAD Model
10AX066N2F40E2LG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 588 | |
Number of Outputs | 588 | |
Number of Logic Cells | 660000 | |
Number of CLBs | 25168 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 25168 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1517 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1517,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1517,39X39,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX066N2F40E2LG Datasheet Download
10AX066N2F40E2LG Overview
The chip model 10AX066N2F40E2LG is a highly advanced, state-of-the-art integrated circuit that has been designed to meet a wide range of modern communication needs. It is a low-power, high-performance chip that is suitable for a variety of applications, including wireless, wired, and optical communication systems.
The original design intention of the chip model 10AX066N2F40E2LG was to create a highly reliable, low-power chip that could be used in a wide range of communication systems. It is capable of providing excellent performance while consuming minimal power. The chip model 10AX066N2F40E2LG is also designed to be easily upgradable, allowing for the addition of new features and capabilities as needed.
The chip model 10AX066N2F40E2LG is well-suited for use in advanced communication systems, such as 5G networks, as well as in intelligent scenarios. It can be used to provide improved performance and energy efficiency in a variety of applications, including voice and data communications, video streaming, and more. In addition, the chip model 10AX066N2F40E2LG is capable of being used in the era of fully intelligent systems, as it is designed to be compatible with a wide range of AI-enabled applications.
The product description of the chip model 10AX066N2F40E2LG is comprehensive and provides detailed information on its features and capabilities. It is designed to be compatible with a variety of communication systems, including both wired and wireless networks. The chip model 10AX066N2F40E2LG is also designed to be highly reliable and efficient, with features such as low power consumption and high performance. Additionally, the chip model 10AX066N2F40E2LG is designed to be easily upgradable, allowing for the addition of new features and capabilities as needed.
In addition to the product description, there are numerous case studies that have been conducted to evaluate the performance of the chip model 10AX066N2F40E2LG in various scenarios. The results of these studies have been overwhelmingly positive, with the chip model 10AX066N2F40E2LG consistently showing improved performance and energy efficiency when compared to other solutions.
Finally, there are a few precautions to be aware of when using the chip model 10AX066N2F40E2LG. For example, it is important to ensure that the chip model 10AX066N2F40E2LG is properly cooled, as it can become damaged if overheated. Additionally, it is important to ensure that the chip model 10AX066N2F40E2LG is properly configured and that the latest firmware is installed, as this can help to ensure optimal performance.
Overall, the chip model 10AX066N2F40E2LG is an excellent choice for a wide range of communication needs. Its original design intention was to create a highly reliable, low-power chip that could be used in a variety of communication systems. It is capable of providing excellent performance while consuming minimal power, and is well-suited for use in advanced communication systems, such as 5G networks, as well as in intelligent scenarios. The product description of the chip model 10AX066N2F40E2LG provides detailed information on its features and capabilities, and numerous case studies have been conducted to evaluate its performance. Finally, it is important to take certain precautions when using the chip model 10AX066N2F40E2LG, such as ensuring that it is properly cooled and configured.
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5,085 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $18,475.1661 | $18,475.1661 |
10+ | $18,276.5084 | $182,765.0840 |
100+ | $17,283.2199 | $1,728,321.9900 |
1000+ | $16,289.9314 | $8,144,965.7000 |
10000+ | $14,899.3275 | $14,899,327.5000 |
The price is for reference only, please refer to the actual quotation! |