Intel Corporation
10AX066K4F35E3SG
10AX066K4F35E3SG ECAD Model
10AX066K4F35E3SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 396 | |
| Number of Outputs | 396 | |
| Number of Logic Cells | 660000 | |
| Number of CLBs | 25168 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 25168 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
10AX066K4F35E3SG Datasheet Download
10AX066K4F35E3SG Overview
Chip model 10AX066K4F35E3SG is an advanced chip model developed by a leading semiconductor company. It is designed for a range of applications, including communication systems, intelligent robots, and other advanced technologies. This chip model is a high-performance integrated circuit that offers high-speed data processing and low power consumption.
The industry trends of the chip model 10AX066K4F35E3SG involve the development of advanced communication systems, intelligent robots, and other advanced technologies. With the rapid development of technology, the chip model 10AX066K4F35E3SG is expected to be applied in new applications and environments, such as the Internet of Things, autonomous vehicles, and smart homes. In order to maximize the performance of the chip model 10AX066K4F35E3SG, it is necessary to consider the application environment and the corresponding requirements.
The original design intention of the chip model 10AX066K4F35E3SG is to provide high-speed data processing and low power consumption. It is also possible to upgrade the chip model 10AX066K4F35E3SG in the future. In order to make the most of the chip model 10AX066K4F35E3SG, it is necessary to consider the future development of related industries and the application environment.
The chip model 10AX066K4F35E3SG can be applied to the development and popularization of future intelligent robots. To use the model effectively, it is necessary to have technical talents who are familiar with the model and its features. It is also important to consider the application environment and the corresponding requirements.
In conclusion, the chip model 10AX066K4F35E3SG is a high-performance integrated circuit that offers high-speed data processing and low power consumption. It can be applied to advanced communication systems, intelligent robots, and other advanced technologies. In order to maximize the performance of the chip model 10AX066K4F35E3SG, it is necessary to consider the industry trends, the original design intention, and the application environment. It is also important to consider the future development of related industries and the technical talents needed to use the model effectively.
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4,596 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,806.4320 | $1,806.4320 |
| 10+ | $1,787.0080 | $17,870.0800 |
| 100+ | $1,689.8880 | $168,988.8000 |
| 1000+ | $1,592.7680 | $796,384.0000 |
| 10000+ | $1,456.8000 | $1,456,800.0000 |
| The price is for reference only, please refer to the actual quotation! | ||