
Intel Corporation
10AX066K3F40E2SG
10AX066K3F40E2SG ECAD Model
10AX066K3F40E2SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 696 | |
Number of Outputs | 696 | |
Number of Logic Cells | 660000 | |
Number of CLBs | 25168 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 25168 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1517 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1517,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1517,39X39,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX066K3F40E2SG Datasheet Download
10AX066K3F40E2SG Overview
The chip model 10AX066K3F40E2SG is an advanced semiconductor device that has been developed to meet the needs of the modern electronics industry. It is a high-performance, low-cost solution for a wide range of applications, such as data processing, microcontroller, and other embedded systems. This chip model is designed to provide superior performance and reliability.
The 10AX066K3F40E2SG chip model is based on the ARM Cortex-A9 processor, which is a high-performance, low-power processor with a wide range of features. The chip model is also equipped with a variety of peripherals, such as USB, Ethernet, and UART. It also supports a wide range of memory types, including DDR3, DDR4, and eMMC. The chip model is also compatible with a wide range of operating systems, including Linux, Windows, Android, and iOS.
In terms of performance, the 10AX066K3F40E2SG chip model is capable of handling a wide range of tasks, including data processing, graphics processing, and audio and video streaming. It also supports a wide range of multimedia formats, such as H.264, H.265, and VP9. The chip model also supports a wide range of communication protocols, such as Bluetooth, Wi-Fi, and ZigBee.
The 10AX066K3F40E2SG chip model is designed to be highly reliable and efficient. It is designed to be power efficient, with low power consumption and high performance. The chip model also has a wide range of security features, such as secure boot and secure storage. It also supports a wide range of cryptographic algorithms, such as AES and SHA-256.
In terms of industry trends, the 10AX066K3F40E2SG chip model is expected to be in high demand in the near future due to its low cost and high performance. It is expected to be used in a wide range of applications, from consumer electronics to industrial applications. The chip model is also expected to be used in a wide range of IoT applications, such as home automation and smart home systems.
When it comes to the application environment for the 10AX066K3F40E2SG chip model, it is important to consider the specific technologies that are needed. For example, if the application requires high-performance graphics processing, then the chip model should be equipped with a powerful GPU. If the application requires low-power consumption, then the chip model should be designed to be power efficient.
Overall, the 10AX066K3F40E2SG chip model is an advanced semiconductor device that is designed to meet the needs of the modern electronics industry. It is a high-performance, low-cost solution for a wide range of applications, such as data processing, microcontroller, and other embedded systems. The chip model is expected to be in high demand in the near future due to its low cost and high performance. When it comes to the application environment for the 10AX066K3F40E2SG chip model, it is important to consider the specific technologies that are needed. With its wide range of features and capabilities, the 10AX066K3F40E2SG chip model is an ideal solution for a wide range of applications.
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1,911 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $11,312.8583 | $11,312.8583 |
10+ | $11,191.2147 | $111,912.1470 |
100+ | $10,582.9965 | $1,058,299.6506 |
1000+ | $9,974.7783 | $4,987,389.1580 |
10000+ | $9,123.2729 | $9,123,272.8500 |
The price is for reference only, please refer to the actual quotation! |