
Intel Corporation
10AX066K3F35E2SG
10AX066K3F35E2SG ECAD Model
10AX066K3F35E2SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 396 | |
Number of Outputs | 396 | |
Number of Logic Cells | 660000 | |
Number of CLBs | 25168 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 25168 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1152,34X34,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX066K3F35E2SG Datasheet Download
10AX066K3F35E2SG Overview
The chip model 10AX066K3F35E2SG is a high-performance, low-power device designed for digital signal processing, embedded processing, and image processing applications. It is designed to be used with the HDL language, which allows for more efficient and powerful processing capabilities. This makes it ideal for applications such as networks and intelligent systems, where it can be used to process large amounts of data quickly and accurately.
The product description of the chip model 10AX066K3F35E2SG states that it is a low-power device designed for digital signal processing, embedded processing, and image processing applications. It has a range of features that make it suitable for these applications, including a high-performance processor, memory, and I/O capabilities. It also has an integrated power management system, which allows it to be used in low-power applications.
In terms of its actual design requirements, the chip model 10AX066K3F35E2SG is designed to be used with the HDL language. This allows for more efficient and powerful processing capabilities, which makes it ideal for applications such as networks and intelligent systems. It also has a range of features that make it suitable for these applications, including an integrated power management system and a range of I/O capabilities.
The chip model 10AX066K3F35E2SG can be used in a variety of intelligent scenarios, such as networks, image processing, and embedded processing. It is a low-power device, which makes it ideal for use in low-power applications. In addition, its integrated power management system allows it to be used in high-performance applications, such as image processing and embedded processing.
In terms of actual case studies, the chip model 10AX066K3F35E2SG has been used in a variety of applications, including networks, image processing, and embedded processing. In each of these applications, it has been used to process large amounts of data quickly and accurately. In addition, it has been used in the era of fully intelligent systems, where it has been used to process data from sensors and other sources.
When designing with the chip model 10AX066K3F35E2SG, there are a few precautions that should be taken. Firstly, it should be used with the HDL language to ensure maximum performance. Secondly, its power management system should be taken into account when designing the application. Finally, it should be tested thoroughly before deployment to ensure that it meets the requirements of the application.
In conclusion, the chip model 10AX066K3F35E2SG is a high-performance, low-power device designed for digital signal processing, embedded processing, and image processing applications. It is designed to be used with the HDL language, which allows for more efficient and powerful processing capabilities. It can be used in a variety of intelligent scenarios, such as networks, image processing, and embedded processing. In addition, it has a range of features that make it suitable for these applications, including an integrated power management system and a range of I/O capabilities. When designing with the chip model 10AX066K3F35E2SG, precautions should be taken to ensure maximum performance and reliability.
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1,643 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $10,414.3904 | $10,414.3904 |
10+ | $10,302.4077 | $103,024.0766 |
100+ | $9,742.4942 | $974,249.4204 |
1000+ | $9,182.5807 | $4,591,290.3720 |
10000+ | $8,398.7019 | $8,398,701.9000 |
The price is for reference only, please refer to the actual quotation! |