10AX066K3F35E2SG
10AX066K3F35E2SG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AX066K3F35E2SG


10AX066K3F35E2SG
F18-10AX066K3F35E2SG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1152,34X34,40
BGA, BGA1152,34X34,40

10AX066K3F35E2SG ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

10AX066K3F35E2SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 396
Number of Outputs 396
Number of Logic Cells 660000
Number of CLBs 25168
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology TSMC
Organization 25168 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1152,34X34,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AX066K3F35E2SG Datasheet Download


10AX066K3F35E2SG Overview



The chip model 10AX066K3F35E2SG is a high-performance, low-power device designed for digital signal processing, embedded processing, and image processing applications. It is designed to be used with the HDL language, which allows for more efficient and powerful processing capabilities. This makes it ideal for applications such as networks and intelligent systems, where it can be used to process large amounts of data quickly and accurately.


The product description of the chip model 10AX066K3F35E2SG states that it is a low-power device designed for digital signal processing, embedded processing, and image processing applications. It has a range of features that make it suitable for these applications, including a high-performance processor, memory, and I/O capabilities. It also has an integrated power management system, which allows it to be used in low-power applications.


In terms of its actual design requirements, the chip model 10AX066K3F35E2SG is designed to be used with the HDL language. This allows for more efficient and powerful processing capabilities, which makes it ideal for applications such as networks and intelligent systems. It also has a range of features that make it suitable for these applications, including an integrated power management system and a range of I/O capabilities.


The chip model 10AX066K3F35E2SG can be used in a variety of intelligent scenarios, such as networks, image processing, and embedded processing. It is a low-power device, which makes it ideal for use in low-power applications. In addition, its integrated power management system allows it to be used in high-performance applications, such as image processing and embedded processing.


In terms of actual case studies, the chip model 10AX066K3F35E2SG has been used in a variety of applications, including networks, image processing, and embedded processing. In each of these applications, it has been used to process large amounts of data quickly and accurately. In addition, it has been used in the era of fully intelligent systems, where it has been used to process data from sensors and other sources.


When designing with the chip model 10AX066K3F35E2SG, there are a few precautions that should be taken. Firstly, it should be used with the HDL language to ensure maximum performance. Secondly, its power management system should be taken into account when designing the application. Finally, it should be tested thoroughly before deployment to ensure that it meets the requirements of the application.


In conclusion, the chip model 10AX066K3F35E2SG is a high-performance, low-power device designed for digital signal processing, embedded processing, and image processing applications. It is designed to be used with the HDL language, which allows for more efficient and powerful processing capabilities. It can be used in a variety of intelligent scenarios, such as networks, image processing, and embedded processing. In addition, it has a range of features that make it suitable for these applications, including an integrated power management system and a range of I/O capabilities. When designing with the chip model 10AX066K3F35E2SG, precautions should be taken to ensure maximum performance and reliability.



1,643 In Stock


I want to buy

Unit Price: $11,198.2692
The price is for reference only.
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
1+ $10,414.3904 $10,414.3904
10+ $10,302.4077 $103,024.0766
100+ $9,742.4942 $974,249.4204
1000+ $9,182.5807 $4,591,290.3720
10000+ $8,398.7019 $8,398,701.9000
The price is for reference only, please refer to the actual quotation!

Quick Quote