Intel Corporation
10AX066K2F35I2SG
10AX066K2F35I2SG ECAD Model
10AX066K2F35I2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 396 | |
| Number of Outputs | 396 | |
| Number of Logic Cells | 660000 | |
| Number of CLBs | 25168 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 25168 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX066K2F35I2SG Datasheet Download
10AX066K2F35I2SG Overview
The chip model 10AX066K2F35I2SG is an advanced processor that is suitable for high-performance digital signal processing, embedded processing, image processing and other applications. It is an integrated circuit that requires the use of HDL language for programming. The 10AX066K2F35I2SG chip model has several advantages over other processor models, such as a high clock speed, low power consumption, and a wide instruction set.
The 10AX066K2F35I2SG chip model is expected to be in high demand in the near future due to its advanced features and capabilities. It can be used in a variety of industries, such as automotive, aerospace, robotics, and medical. It is also suitable for use in networks, allowing for faster communication between devices. Additionally, the chip model can be used in intelligent scenarios, such as facial recognition, object detection, and natural language processing.
The 10AX066K2F35I2SG chip model is expected to be an integral part of the future of intelligent systems. It has the potential to be used in a variety of applications, such as autonomous vehicles, smart homes, and smart cities. It can also be used to power intelligent devices such as robots and drones. The chip model is capable of performing complex tasks, such as natural language processing, image recognition, and facial recognition.
The 10AX066K2F35I2SG chip model is a powerful processor that is capable of powering the next generation of intelligent systems. Its high clock speed, low power consumption, and wide instruction set make it ideal for a variety of applications. It is expected to be in high demand in the near future, as it can be used in networks, intelligent scenarios, and autonomous systems. The 10AX066K2F35I2SG chip model is the perfect processor for the future of intelligent systems.
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1,428 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $13,252.5069 | $13,252.5069 |
| 10+ | $13,110.0068 | $131,100.0681 |
| 100+ | $12,397.5064 | $1,239,750.6438 |
| 1000+ | $11,685.0061 | $5,842,503.0340 |
| 10000+ | $10,687.5056 | $10,687,505.5500 |
| The price is for reference only, please refer to the actual quotation! | ||