10AX066K2F35I1SG
10AX066K2F35I1SG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AX066K2F35I1SG


10AX066K2F35I1SG
F18-10AX066K2F35I1SG
Active
FIELD PROGRAMMABLE GATE ARRAY, BGA, BGA1152,34X34,40
BGA, BGA1152,34X34,40

10AX066K2F35I1SG ECAD Model


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10AX066K2F35I1SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 900 mV
Number of Inputs 696
Number of Outputs 696
Number of Logic Cells 660000
Number of CLBs 25168
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Organization 25168 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1152
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1152,34X34,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AX066K2F35I1SG Datasheet Download


10AX066K2F35I1SG Overview



The chip model 10AX066K2F35I1SG is a highly advanced integrated circuit (IC) and system-on-chip (SoC) that has been designed to meet the needs of the modern digital world. It is a cutting-edge product that has been designed to provide the highest levels of performance and reliability. This chip model is capable of providing a wide range of features and functions, making it a versatile and powerful choice for any application.


The 10AX066K2F35I1SG chip model offers a number of advantages over other ICs and SoCs. It is capable of providing high-speed data processing, as well as providing a wide range of features and functions for various applications. It is also designed to be highly reliable, with a low power consumption and a long lifetime. This makes it an ideal choice for applications that require a high level of performance and reliability.


The 10AX066K2F35I1SG chip model is expected to be in high demand in the near future, as it is capable of providing a wide range of features and functions for a variety of applications. It is expected to be used in a wide range of industries, including telecommunications, automotive, medical, and aerospace. It is also expected to be used in the Internet of Things (IoT) and artificial intelligence (AI) applications, as it is capable of providing a high level of performance and reliability for these applications.


The 10AX066K2F35I1SG chip model is capable of being used in networks and intelligent scenarios. It is capable of providing a high level of performance and reliability for these applications, making it an ideal choice for these scenarios. It is also capable of being used in the era of fully intelligent systems, as it is capable of providing a wide range of features and functions for these applications.


The 10AX066K2F35I1SG chip model has a number of design requirements that must be met in order for it to be used in various applications. These requirements include a low power consumption, a high level of performance, a long lifetime, and a wide range of features and functions. In addition, the chip model must also meet certain environmental requirements, such as temperature and humidity, in order to be used in various applications.


In order to understand how the 10AX066K2F35I1SG chip model works, it is important to look at actual case studies and precautions. Case studies can provide an understanding of how the chip model works in various scenarios and can help to identify any potential issues that may arise. It is also important to take precautions when using the chip model, as it is capable of providing a high level of performance and reliability, but can also be susceptible to damage if not properly handled.


Overall, the 10AX066K2F35I1SG chip model is a highly advanced and reliable integrated circuit and system-on-chip that is capable of providing a wide range of features and functions for various applications. It is expected to be in high demand in the near future, as it is capable of providing a high level of performance and reliability for various applications. It is also capable of being used in networks and intelligent scenarios, as well as being used in the era of fully intelligent systems. In order to use the chip model, it is important to understand the design requirements and take the necessary precautions.



5,645 In Stock


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Unit Price: $12,340.1472
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $11,476.3369 $11,476.3369
10+ $11,352.9354 $113,529.3542
100+ $10,735.9281 $1,073,592.8064
1000+ $10,118.9207 $5,059,460.3520
10000+ $9,255.1104 $9,255,110.4000
The price is for reference only, please refer to the actual quotation!

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