
Intel Corporation
10AX066K2F35I1SG
10AX066K2F35I1SG ECAD Model
10AX066K2F35I1SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 696 | |
Number of Outputs | 696 | |
Number of Logic Cells | 660000 | |
Number of CLBs | 25168 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Organization | 25168 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1152,34X34,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX066K2F35I1SG Datasheet Download
10AX066K2F35I1SG Overview
The chip model 10AX066K2F35I1SG is a highly advanced integrated circuit (IC) and system-on-chip (SoC) that has been designed to meet the needs of the modern digital world. It is a cutting-edge product that has been designed to provide the highest levels of performance and reliability. This chip model is capable of providing a wide range of features and functions, making it a versatile and powerful choice for any application.
The 10AX066K2F35I1SG chip model offers a number of advantages over other ICs and SoCs. It is capable of providing high-speed data processing, as well as providing a wide range of features and functions for various applications. It is also designed to be highly reliable, with a low power consumption and a long lifetime. This makes it an ideal choice for applications that require a high level of performance and reliability.
The 10AX066K2F35I1SG chip model is expected to be in high demand in the near future, as it is capable of providing a wide range of features and functions for a variety of applications. It is expected to be used in a wide range of industries, including telecommunications, automotive, medical, and aerospace. It is also expected to be used in the Internet of Things (IoT) and artificial intelligence (AI) applications, as it is capable of providing a high level of performance and reliability for these applications.
The 10AX066K2F35I1SG chip model is capable of being used in networks and intelligent scenarios. It is capable of providing a high level of performance and reliability for these applications, making it an ideal choice for these scenarios. It is also capable of being used in the era of fully intelligent systems, as it is capable of providing a wide range of features and functions for these applications.
The 10AX066K2F35I1SG chip model has a number of design requirements that must be met in order for it to be used in various applications. These requirements include a low power consumption, a high level of performance, a long lifetime, and a wide range of features and functions. In addition, the chip model must also meet certain environmental requirements, such as temperature and humidity, in order to be used in various applications.
In order to understand how the 10AX066K2F35I1SG chip model works, it is important to look at actual case studies and precautions. Case studies can provide an understanding of how the chip model works in various scenarios and can help to identify any potential issues that may arise. It is also important to take precautions when using the chip model, as it is capable of providing a high level of performance and reliability, but can also be susceptible to damage if not properly handled.
Overall, the 10AX066K2F35I1SG chip model is a highly advanced and reliable integrated circuit and system-on-chip that is capable of providing a wide range of features and functions for various applications. It is expected to be in high demand in the near future, as it is capable of providing a high level of performance and reliability for various applications. It is also capable of being used in networks and intelligent scenarios, as well as being used in the era of fully intelligent systems. In order to use the chip model, it is important to understand the design requirements and take the necessary precautions.
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5,645 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $11,476.3369 | $11,476.3369 |
10+ | $11,352.9354 | $113,529.3542 |
100+ | $10,735.9281 | $1,073,592.8064 |
1000+ | $10,118.9207 | $5,059,460.3520 |
10000+ | $9,255.1104 | $9,255,110.4000 |
The price is for reference only, please refer to the actual quotation! |