Intel Corporation
10AX066K2F35E1SG
10AX066K2F35E1SG ECAD Model
10AX066K2F35E1SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 696 | |
| Number of Outputs | 696 | |
| Number of Logic Cells | 660000 | |
| Number of CLBs | 25168 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 25168 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX066K2F35E1SG Datasheet Download
10AX066K2F35E1SG Overview
The chip model 10AX066K2F35E1SG is one of the most advanced and versatile chip models available on the market today. It offers a wide range of advantages and features that make it an ideal choice for a variety of applications.
The 10AX066K2F35E1SG chip model is designed to provide a high level of performance and reliability for a range of applications. It is equipped with an advanced microprocessor, a high-speed memory controller, and a wide range of I/O ports. This chip model is also capable of supporting multiple protocols, allowing it to be used in a variety of networks and communication systems.
The 10AX066K2F35E1SG chip model is expected to experience a high demand in the coming years due to its advanced features and capabilities. It is expected to be particularly popular in the telecommunications, automotive, and industrial automation industries, as well as in the consumer electronics sector. This chip model is also expected to be used in a variety of other applications, such as in medical devices, robotics, and smart home systems.
The 10AX066K2F35E1SG chip model is designed to be highly customizable and upgradeable. It is capable of being used in a variety of advanced communication systems, and its features can be further enhanced with the use of additional software and hardware. This chip model is also capable of being used in a variety of intelligent scenarios, such as in the era of fully intelligent systems. It is also capable of being used in a variety of networks, including wireless and wired networks.
The 10AX066K2F35E1SG chip model is expected to be a popular choice in the future due to its advanced features and capabilities. It is expected to be used in a variety of applications, ranging from telecommunications and automotive to industrial automation and consumer electronics. It is also expected to be used in a variety of intelligent scenarios, such as in the era of fully intelligent systems. It is also capable of being used in a variety of networks, including wireless and wired networks. The 10AX066K2F35E1SG chip model is expected to be a popular choice in the future due to its advanced features and capabilities.
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5,082 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $10,041.1616 | $10,041.1616 |
| 10+ | $9,933.1922 | $99,331.9216 |
| 100+ | $9,393.3448 | $939,334.4760 |
| 1000+ | $8,853.4974 | $4,426,748.6800 |
| 10000+ | $8,097.7110 | $8,097,711.0000 |
| The price is for reference only, please refer to the actual quotation! | ||