Intel Corporation
10AX066H4F34I3SG
10AX066H4F34I3SG ECAD Model
10AX066H4F34I3SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 492 | |
| Number of Outputs | 492 | |
| Number of Logic Cells | 660000 | |
| Number of CLBs | 25168 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 25168 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX066H4F34I3SG Datasheet Download
10AX066H4F34I3SG Overview
The chip model 10AX066H4F34I3SG is a powerful and versatile processor that is well-suited for a variety of applications. It is capable of high-performance digital signal processing, embedded processing, and image processing, and requires the use of HDL language. This chip model has the potential to be used in a variety of networks and intelligent scenarios, and could be used in the era of fully intelligent systems.
In order to ensure the successful implementation of the chip model 10AX066H4F34I3SG, it is important to understand the product description and specific design requirements. The product description includes the processor type, clock speed, memory size, and other features. It is also important to have a clear understanding of the specific design requirements, such as the type of HDL language that is needed and the types of data that can be processed.
In addition to understanding the product description and design requirements, it is also important to consider actual case studies and any precautions that may be necessary when using the chip model 10AX066H4F34I3SG. For example, it is important to consider the power requirements of the chip and any cooling or heat dissipation measures that may be necessary. It is also important to consider the compatibility of the chip with other components, such as memory and other peripherals, and to ensure that the chip is properly tested and verified before being put into use.
In conclusion, the chip model 10AX066H4F34I3SG is a powerful and versatile processor that is well-suited for a variety of applications. It is capable of high-performance digital signal processing, embedded processing, and image processing, and requires the use of HDL language. This chip model has the potential to be used in a variety of networks and intelligent scenarios, and could be used in the era of fully intelligent systems. In order to ensure the successful implementation of the chip model 10AX066H4F34I3SG, it is important to understand the product description and design requirements, as well as any case studies and precautions that may be necessary when using the chip.
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3,754 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $7,830.0234 | $7,830.0234 |
| 10+ | $7,745.8296 | $77,458.2960 |
| 100+ | $7,324.8606 | $732,486.0600 |
| 1000+ | $6,903.8916 | $3,451,945.8000 |
| 10000+ | $6,314.5350 | $6,314,535.0000 |
| The price is for reference only, please refer to the actual quotation! | ||