Intel Corporation
10AX066H4F34I3LG
10AX066H4F34I3LG ECAD Model
10AX066H4F34I3LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 492 | |
| Number of Outputs | 492 | |
| Number of Logic Cells | 660000 | |
| Number of CLBs | 25168 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 25168 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX066H4F34I3LG Datasheet Download
10AX066H4F34I3LG Overview
The chip model 10AX066H4F34I3LG is a powerful and versatile chip model manufactured by the leading chip manufacturer in the industry. It is designed to provide reliable, high-performance computing power for a variety of applications, ranging from consumer electronics to industrial automation. This model is extremely well-suited for use in a variety of industries, such as telecommunications, automotive, aerospace, and medical.
The chip model 10AX066H4F34I3LG is designed to provide high-level performance, reliability, and scalability. It is capable of handling complex tasks and operations with ease, and its advanced features make it suitable for a variety of applications. Its low power consumption and high efficiency make it an ideal choice for applications that require a high level of performance and reliability.
The chip model 10AX066H4F34I3LG is designed to be a highly reliable and efficient chip model. It is designed to handle a variety of tasks and operations with ease, and its advanced features make it suitable for a variety of applications. Its low power consumption and high efficiency make it an ideal choice for applications that require a high level of performance and reliability.
The chip model 10AX066H4F34I3LG is expected to see a significant increase in demand in the coming years. This is due to the rising demand for high-performance and reliable chips in a variety of industries, such as telecommunications, automotive, aerospace, and medical. The chip model is also expected to be used in advanced communication systems, networks, and intelligent scenarios in the future.
The chip model 10AX066H4F34I3LG is designed to be highly versatile and can be upgraded in the future to meet the needs of the ever-changing market. It is capable of handling complex tasks and operations with ease, and its advanced features make it suitable for a variety of applications. Its low power consumption and high efficiency make it an ideal choice for applications that require a high level of performance and reliability.
The chip model 10AX066H4F34I3LG is expected to be used in many advanced communication systems, networks, and intelligent scenarios in the future. It is capable of handling complex tasks and operations with ease, and its advanced features make it suitable for a variety of applications. Its low power consumption and high efficiency make it an ideal choice for applications that require a high level of performance and reliability.
The chip model 10AX066H4F34I3LG is expected to be used in many intelligent scenarios in the future, such as autonomous vehicles, intelligent homes, and smart cities. It is capable of handling complex tasks and operations with ease, and its advanced features make it suitable for a variety of applications. Its low power consumption and high efficiency make it an ideal choice for applications that require a high level of performance and reliability.
Overall, the chip model 10AX066H4F34I3LG is a powerful and reliable chip model that is designed to provide high-level performance, reliability, and scalability. It is expected to be used in many advanced communication systems, networks, and intelligent scenarios in the future. Its low power consumption and high efficiency make it an ideal choice for applications that require a high level of performance and reliability.
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4,363 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $9,790.5144 | $9,790.5144 |
| 10+ | $9,685.2400 | $96,852.4002 |
| 100+ | $9,158.8683 | $915,886.8276 |
| 1000+ | $8,632.4965 | $4,316,248.2680 |
| 10000+ | $7,895.5761 | $7,895,576.1000 |
| The price is for reference only, please refer to the actual quotation! | ||