Intel Corporation
10AX066H3F34E2SG
10AX066H3F34E2SG ECAD Model
10AX066H3F34E2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 492 | |
| Number of Outputs | 492 | |
| Number of Logic Cells | 660000 | |
| Number of CLBs | 25168 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 25168 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX066H3F34E2SG Datasheet Download
10AX066H3F34E2SG Overview
The chip model 10AX066H3F34E2SG is a high-performance, low-power integrated circuit designed for a variety of applications. It is a single-chip solution that integrates a variety of functions and features into a single package. Its original design intention was to provide a cost-effective and reliable solution for a wide range of applications, such as communication systems, consumer electronics, automotive systems, and industrial automation.
The chip model 10AX066H3F34E2SG is capable of supporting a wide range of communication protocols, including 2G, 3G, 4G, 5G, and Wi-Fi. It is also capable of supporting advanced communication systems, such as LTE, WCDMA, GSM, and CDMA. It is also capable of supporting a variety of data transfer protocols, including USB, Ethernet, and Serial. In addition, it is also capable of supporting a variety of operating systems, including Windows, Linux, and Android.
The chip model 10AX066H3F34E2SG is capable of supporting a wide range of applications, such as medical equipment, smart home systems, and industrial automation. It is also capable of supporting a variety of advanced technologies, such as artificial intelligence, machine learning, and the Internet of Things.
The chip model 10AX066H3F34E2SG is capable of providing a reliable and cost-effective solution for a variety of applications. It is also capable of providing a high-performance, low-power solution for a wide range of applications. In addition, it is also capable of providing a secure and robust solution for a variety of applications.
The chip model 10AX066H3F34E2SG is capable of being upgraded in the future. It is also capable of being applied to advanced communication systems. It is also capable of being applied to the development and popularization of future intelligent robots. However, in order to use the model effectively, a certain level of technical knowledge is required.
In order to use the chip model 10AX066H3F34E2SG effectively, it is important to understand the product description and specific design requirements. It is also important to understand the actual case studies and precautions associated with the model. Additionally, it is important to understand the potential applications and the necessary technical skills required to use the model effectively.
Overall, the chip model 10AX066H3F34E2SG is a high-performance, low-power integrated circuit designed for a variety of applications. It is capable of providing a reliable and cost-effective solution for a variety of applications. It is also capable of being upgraded in the future and being applied to advanced communication systems, as well as being applied to the development and popularization of future intelligent robots. However, in order to use the model effectively, a certain level of technical knowledge is required.
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2,895 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $8,614.2075 | $8,614.2075 |
| 10+ | $8,521.5816 | $85,215.8160 |
| 100+ | $8,058.4522 | $805,845.2169 |
| 1000+ | $7,595.3227 | $3,797,661.3670 |
| 10000+ | $6,946.9415 | $6,946,941.5250 |
| The price is for reference only, please refer to the actual quotation! | ||