Intel Corporation
10AX066H3F34E2LG
10AX066H3F34E2LG ECAD Model
10AX066H3F34E2LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 492 | |
| Number of Outputs | 492 | |
| Number of Logic Cells | 660000 | |
| Number of CLBs | 25168 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 25168 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX066H3F34E2LG Datasheet Download
10AX066H3F34E2LG Overview
The chip model 10AX066H3F34E2LG is a high-performance digital signal processing, embedded processing, and image processing chip that is designed for use in a variety of applications. It is capable of handling complex tasks and requires the use of HDL language for its programming. This chip model is a great choice for those looking for a reliable and powerful processor for their projects.
The 10AX066H3F34E2LG chip model offers a number of advantages over other models. It is capable of processing large amounts of data quickly, and it is able to handle complex tasks with ease. Additionally, the chip model is designed to be energy-efficient, meaning that users can save money on their energy bills. Lastly, the chip model is designed to be compatible with a variety of hardware and software platforms, making it a great choice for those looking to use the chip model in a variety of applications.
As technology continues to advance, the demand for the 10AX066H3F34E2LG chip model is expected to increase. This is due to its ability to handle complex tasks and its compatibility with a variety of hardware and software platforms. This chip model is ideal for those looking to use it for high-performance digital signal processing, embedded processing, and image processing. Additionally, the chip model is expected to be used in a variety of network applications and intelligent scenarios in the future.
The 10AX066H3F34E2LG chip model is capable of being used in the era of fully intelligent systems. This chip model is designed to be compatible with a variety of hardware and software platforms and is capable of handling complex tasks. Additionally, this chip model is energy-efficient, meaning that users can save money on their energy bills. This chip model is a great choice for those looking to use it in a variety of applications and intelligent scenarios in the future.
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4,640 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,465.6309 | $2,465.6309 |
| 10+ | $2,439.1187 | $24,391.1872 |
| 100+ | $2,306.5579 | $230,655.7920 |
| 1000+ | $2,173.9971 | $1,086,998.5600 |
| 10000+ | $1,988.4120 | $1,988,412.0000 |
| The price is for reference only, please refer to the actual quotation! | ||