Intel Corporation
10AX066H2F34E1SG
10AX066H2F34E1SG ECAD Model
10AX066H2F34E1SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 696 | |
| Number of Outputs | 696 | |
| Number of Logic Cells | 660000 | |
| Number of CLBs | 25168 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 25168 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 34 mm | |
| Length | 34 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX066H2F34E1SG Datasheet Download
10AX066H2F34E1SG Overview
The chip model 10AX066H2F34E1SG is a high-performance, low-power chip designed for digital signal processing, embedded processing, image processing, and other applications. It is designed to be used with HDL (Hardware Description Language) and is capable of efficiently handling complex data processing tasks. The design of the chip model 10AX066H2F34E1SG is focused on achieving maximum performance while minimizing power consumption.
The original design of the chip model 10AX066H2F34E1SG was intended to provide a high-performance, low-power solution for digital signal processing, embedded processing, image processing, and other applications. It is also capable of being upgraded in the future to support more advanced communication systems. The chip model 10AX066H2F34E1SG is designed to be used with HDL, and it is important to understand the specific design requirements of the chip before using it.
The chip model 10AX066H2F34E1SG is designed to provide maximum performance while minimizing power consumption. It is capable of efficiently handling complex data processing tasks, and its design is focused on achieving maximum performance while minimizing power consumption. It is also designed to be highly reliable and durable, making it suitable for long-term use.
In order to ensure that the chip model 10AX066H2F34E1SG is used correctly and safely, it is important to understand the product description and design requirements of the chip. It is also important to understand the actual case studies and precautions associated with the chip. This will help to ensure that the chip is used correctly and safely, and that it is able to provide the maximum performance and reliability that it is designed for.
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2,641 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $8,302.0806 | $8,302.0806 |
| 10+ | $8,212.8109 | $82,128.1093 |
| 100+ | $7,766.4625 | $776,646.2508 |
| 1000+ | $7,320.1141 | $3,660,057.0440 |
| 10000+ | $6,695.2263 | $6,695,226.3000 |
| The price is for reference only, please refer to the actual quotation! | ||